Design and manufacture of power devices having increased cross over current

ABSTRACT

An embodiment relates to a n-type planar gate DMOSFET comprising a Silicon Carbide (SiC) substrate. The SiC substrate includes a N+ substrate, a N− drift layer, a P-well region and a first N+ source region within each P-well region. A second N+ source region is formed between the P-well region and a source metal via a silicide layer. During third quadrant operation of the DMOSFET, the second N+ source region starts depleting when a source terminal is positively biased with respect to a drain terminal. The second N+ source region impacts turn-on voltage of body diode regions of the DMOSFET by establishing short-circuitry between the P-well region and the source metal when the second N+ source region is completely depleted.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 16/945,781 filed on Jul. 31, 2020, the contents of which are herebyincorporated by reference in their entirety.

FIELD OF THE INVENTION

This disclosure relates to power semiconductor devices using a verticalsilicon carbide (SiC) double-implantation metal oxide semiconductorfield-effect transistor (DMOSFET). A power metal oxide semiconductorfield-effect transistor (MOSFET) is a specific type of MOSFET designedto handle significant power levels.

BACKGROUND

Silicon based power devices have long dominated power electronics andpower system applications. On the other hand, silicon carbide (SiC) is awider band-gap (Eg) material with Eg=3.3 eV as compared to silicon(Eg=1.1 eV) and hence, SiC has a higher blocking voltage than Silicon(Si). SiC has a higher breakdown electric field (3×10⁶ V/cm to 5×10⁶V/cm) compared to silicon (Si) (breakdown electric field for Si is0.3×10⁶ V/cm) and is a better thermal conductor (3.7 (W/cm-K) for SiCversus 1.6 (W/cm-K) for Si). SiC has been a material of choice for powerMOSFETs. However, “[e]ven with the successful introduction of SiC powerMOSFETs into the commercial marketplace, several key reliability issueshave not been fully resolved.” [source: Key Reliability Issues for SiCPower MOSFETs, A. Lelis, D. Habersat, R. Green, and E. Mooro of the U.S.Army Research Laboratory, published in ECS Transactions, 58 (4) 87-93(2013), DOI: 10.1149/05804.0087ecst].

“[W]hile SiC power MOSFETs share many similarities to silicon MOSFETs,many challenging differences remain. In particular, the wide-bandgapnature of 4H-SiC (EG=3.26 eV) is both a blessing and a curse, bringing alow intrinsic carrier concentration and a high critical electric field,while presenting challenges with inversion-layer mobility andreliability in passivating dielectric layers.” [Source: Challenges inSiC Power MOSFET Design by Kevin Matocha of the GE Global ResearchCenter—Semiconductor Technology Laboratory, Niskayuna, N.Y. USA,published in ISDRS 2007, Dec. 12-14, 2007, College Park, Md., USA].

“[A] silicon carbide (SiC) device may include a gate electrode disposedabove a SiC semiconductor layer, wherein the SiC semiconductor layercomprises: a drift region having a first conductivity type; a wellregion disposed adjacent to the drift region, wherein the well regionhas a second conductivity type; and a source region having the firstconductivity type disposed adjacent to the well region, wherein thesource region comprises a source contact region and a pinch region,wherein the pinch region is disposed only partially below the gateelectrode, wherein a sheet doping density in the pinch region is lessthan 2.5×10¹⁴ cm⁻², and wherein the pinch region is configured todeplete at a current density greater than a nominal current density ofthe SiC device to increase the resistance of the source region.”[source: Silicon carbide device and method of making thereof, PeterAlmern Losee, Ljubisa Dragoljub Stevanovic, Gregory Thomas Dunne,Alexander Viktorovich Bolotnikov, published as U.S. Pat. No. 9,899,512B2on Feb. 20, 2018].

US20190013312A1 discloses body regions numbered 3, 5, respectively, thataccommodate a first and a second source region numbered 4, 6, of the Ntype, extending from the upper surface 2A into the interior of the bodyregions 3, 5 and states: “A first metallization layer extends over thefirst surface and forms, in direct contact with the implanted structureand with the JFET region, a JBS diode.” [source: MOSFET device ofsilicon carbide having an integrated diode and manufacturing processthereof, Mario Giuseppe Saggio, Simone RASCUNÁ, published at USPTO asUS20190013312A1 on Jan. 10, 2019].

“An n-MOSFET device (11) has an n-type channel (2) between a substrate(1) and a gate structure (7, 8), the channel (2) being formed by a layerof n-doped germanium of a thickness such that the channel (2) isfully-depleted with no applied gate voltage whereby the device (11) isoperative in accumulation mode.” [source: Germanium n-mosfet devices andproduction methods, Daniele Caimi, Athanasios Dimoulas, Jean Fompeyrine,Chiara Marchiori, Christophe P. Rossel, Marilyne Sousa, Axelle M.Tapponnier, David J. Webb, published as WO2011013042A1 on Feb. 3, 2011].

U.S. Pat. No. 9,318,597B2 discloses that a semiconductor device thatincludes a vertical field-effect-transistor (FET) and a bypass diode. Itfurther states that the vertical FET device includes a substrate, adrift layer formed over the substrate, a gate contact and a plurality ofsource contacts located on a first surface of the drift layer oppositethe substrate, a drain contact located on a surface of the substrateopposite the drift layer, and a plurality of junction implants, each ofthe plurality of junction implants laterally separated from one anotheron the surface of the drift layer opposite the substrate and extendingdownward toward the substrate and that each of the one or more bypassdiodes are formed by placing a Schottky metal contact on the firstsurface of the drift layer, such that each Schottky metal contact runsbetween two of the plurality of junction implants. [source: Layoutconfigurations for integrating schottky contacts into a power transistordevice, Vipindas Pala, Edward Robert Van Brunt, Lin Cheng, John WilliamsPalmour, published as U.S. Pat. No. 9,318,597B2 at USPTO on Apr. 19,2016].

U.S. Pat. No. 9,876,104B2 discloses a multi-cell MOSFET device includinga MOSFET cell with an integrated Schottky diode wherein the MOSFETincludes n-type source regions formed in p-type well regions which areformed in an n-type drift layer, a p-type body contact region is formedon the periphery of the MOSFET and the source metallization of thedevice forms a Schottky contact with an n-type semiconductor regionadjacent the p-type body contact region of the device. [source: Highvoltage semiconductor devices and methods of making the devices, KevinMatocha, Kiran Chatty, Sujit Banerjee, published as U.S. Pat. No.9,876,104B2 on Jan. 23, 2018].

U.S. Pat. No. 8,436,367B1 discloses that a SiC Power Semiconductordevice of the Field Effect Type (MOSFET, IGBT or the like) with “muted”channel conduction, negative temperature coefficient of channelmobility, in situ “ballasted” source resistors and optimized thermalmanagement of the cells for increased Safe Operating Area is described.Controlling the location of the Zero Temperature Crossover Point (ZTCP)in relationship to the drain current is achieved by the partitionbetween the “active” and “inactive” channels and by adjusting themobility of the carriers in the channel for the temperature range ofinterest.” [source: SiC power vertical DMOS with increased safeoperating area, Dumitru Sdrulla, Marc Vandenberg, published at USPTO asU.S. Pat. No. 8,436,367B1 on May 7, 2013].

Considering the knowledge of persons skilled in the art, there is along-felt need for power devices having increased third quadrant crossover current to overcome performance and reliability issues.

SUMMARY

Disclosed are one or more aspects of design and manufacture of powerdevices having increased third quadrant cross over current.

In one aspect, a device comprising a unit cell on a Silicon Carbide(SiC) substrate is described. The unit cell comprises a firstconductivity type first source region, a first conductivity type secondsource region, a second conductivity type well region and a silicidelayer. The device comprises a vertical Silicon Carbide (SiC)double-implantation metal oxide semiconductor field-effect transistor(DMOSFET) comprising a drain terminal on a backside of the SiC substrateand a source terminal on a topside of the SiC substrate. The firstconductivity type second source region comprises a thickness rangingfrom 1% to 90% lower than a thickness of the first conductivity typefirst source region. The first conductivity type second source region isinterspersed between the second conductivity type well region and thesilicide layer.

In an embodiment, the first conductivity type second source regioncomprises a sheet of source region located between a recessed SiC trenchregion and the second conductivity type well region.

In another embodiment, the sheet of source region comprises a thin sheetof source region.

In yet another embodiment, the first conductivity type second sourceregion comprises at least one of (a) a target thickness and (b) a targetdoping concentration.

In yet another embodiment, the target thickness ranges from 1 nm to 1μm.

In yet another embodiment, the target doping concentration ranges from10¹⁵ cm⁻³ to 10²¹ cm⁻³.

In yet another embodiment, the first conductivity type second sourceregion comprises a sheet of source region located between the silicidelayer and the second conductivity type well region.

In yet another embodiment, the sheet of source region comprises a thinsheet of source region.

In yet another embodiment, the first conductivity type second sourceregion comprises at least one of (a) a target thickness and (b) a targetdoping concentration.

In yet another embodiment, the target thickness ranges from 1 nm to 1μm.

In yet another embodiment, the target doping concentration ranges from10¹⁵ cm⁻³ to 10²¹ cm⁻³.

In yet another embodiment, a doping concentration of the firstconductivity type second source region ranges from 1% to 90% lower thana doping concentration of the first conductivity type first sourceregion.

In another aspect, a device comprising a unit cell on a Silicon Carbide(SiC) substrate is described. The unit cell comprises a firstconductivity type source region, a second conductivity type well contactregion, a second conductivity type well region, a first metal region anda silicide layer. The device comprises a vertical Silicon Carbidedouble-implantation metal oxide semiconductor field-effect transistor(DMOSFET) comprising a drain terminal on a backside of the SiC substrateand a source terminal on a topside of the SiC substrate. The first metalregion is in contact with the second conductivity type well contactregion. The silicide layer is in contact with the second conductivitytype well contact region through the first metal region.

In an embodiment, the first metal region comprises a target workfunction.

In another embodiment, the target work function ranges from 3.5 electronvolts to 6 electron volts.

In yet another aspect, a device comprising a unit cell on a SiliconCarbide (SiC) substrate is described. The unit cell comprises a firstconductivity type source region, a second conductivity type well region,a second conductivity type well contact region and a silicide layer. Thedevice comprises a vertical Silicon Carbide double-implantation metaloxide semiconductor field-effect transistor (DMOSFET) comprising a drainterminal on a backside of the SiC substrate and a source terminal on atopside of the SiC substrate. A lateral extent of the secondconductivity type well contact region varies with a non-zero value indirection orthogonal to the unit cell.

In an embodiment, the second conductivity type well contact regioncomprises a periodic contact with a source metal via the silicide layerbetween an adjacent interlayer dielectric (ILD) region.

In another embodiment, the second conductivity type well contact regioncomprises a periodic spacing between the first conductivity type sourceregion and the second conductivity type well contact region.

In yet another embodiment, the second conductivity type well contactregion comprises a target size, a target spacing between adjacentjunction points located between the second conductivity type wellcontact region, and the silicide layer between the adjacent ILD region.

In yet another embodiment, the target size ranges from 10 nm to 10 μmand the target spacing ranging from 10 nm to 10 μm.

In yet another embodiment, the second conductivity type well contactregion meanders from a perspective of a cross-sectional view of thedevice and the second conductivity type well region contacts with thesilicide layer through the second conductivity type well contact regionalone.

In yet another embodiment, the second conductivity type well contactregion comprises a target size, a target spacing between adjacentjunction points located between the second conductivity type wellcontact region, and the silicide layer between the adjacent ILD region.

In yet another embodiment, the target size ranges from 10 nm to 10 μmand the target spacing ranging from 10 nm to 10 μm.

In yet another aspect, a method of design and manufacture of a powerdevice having increased third quadrant cross over current is described.The method comprises preparing a unit cell of a Silicon Carbide (SiC)substrate comprising a first conductivity type substrate and a firstconductivity type drift layer, forming a second conductivity type wellregion by performing a second conductivity type implantation through afirst patterned hard mask layer on the SiC substrate, forming a firstconductivity type first source region by performing a first conductivitytype implantation through a second patterned hard mask layer on the SiCsubstrate, forming a first conductivity type second source region,through a third patterned hard mask layer between a silicide layer on atopside of the SiC substrate and the second conductivity type wellregion, and forming a vertical Silicon Carbide (SiC) double-implantationmetal oxide semiconductor field-effect transistor (DMOSFET) comprising adrain terminal on a backside of the SiC substrate and a source terminalon the topside of the SiC substrate. The first conductivity type secondsource region comprises a thickness less than a thickness of the firstconductivity type first source region.

In an embodiment, forming the first conductivity type second sourceregion comprises forming a sheet of source region.

In another embodiment, forming the sheet of source region comprisesforming a thin sheet of source region.

In yet another embodiment, forming the first conductivity type secondsource region comprises removing a portion of the SiC substrate byperforming etching onto the topside of the SiC substrate.

In yet another embodiment, forming the first conductivity type secondsource region with at least one of (a) a target thickness and (b) atarget doping concentration is performed by monitoring the etchingperformed onto the SiC substrate, and controlling the etching performedonto the SiC substrate.

In yet another embodiment, forming the first conductivity type secondsource region comprises performing a subsequent first conductivity typeimplantation through the third patterned hard mask layer on the topsideof the SiC substrate.

In yet another embodiment, forming the first conductivity type secondsource region with at least one of (a) a target thickness and (b) atarget doping concentration is performed by monitoring dosage and energylevel of the subsequent first conductivity type implantation, andcontrolling the dosage and the energy level of the subsequent firstconductivity type implantation.

In yet another embodiment, the first conductivity type second sourceregion comprises a doping concentration ranging from 1% to 90% lowerthan a doping concentration of the first conductivity type first sourceregion.

In yet another aspect, a method of design and manufacture of a powerdevice having increased third quadrant cross over current is described.The method includes preparing a unit cell of a Silicon Carbide (SiC)substrate comprising a first conductivity type substrate and a firstconductivity type drift layer, forming a second conductivity type wellregion by performing a second conductivity type implantation through afirst patterned hard mask layer on the SiC substrate, forming a firstconductivity type source region by performing a first conductivity typeimplantation through a second patterned hard mask layer on the SiCsubstrate, forming a second conductivity type well contact region byperforming a subsequent second conductivity type implantation through athird patterned layer on the SiC substrate, forming a first metal regionin direct contact with the second conductivity type well contact region,and forming a vertical Silicon Carbide (SiC) double-implantation metaloxide semiconductor field-effect transistor (DMOSFET) comprising a drainterminal on a backside of the SiC substrate and a source terminal on atopside of the SiC substrate.

In an embodiment, forming the first metal region with a target workfunction is performed by controlling a barrier height of the first metalregion, selecting a metal comprising an appropriate work function, andadjusting thermal temperature and time for annealing a first metalcontact region once the first metal region is formed.

In another embodiment, the method includes forming a second metal regionin direct contact with the first conductivity type drift layer. Thesecond metal region bridges the unit cell and an adjacent unit cell. Awork function of the first metal region is less than a work function ofthe second metal region.

In yet another aspect, a method of design and manufacture of a powerdevice having increased third quadrant cross over current is described.The method includes preparing a unit cell of a Silicon Carbide (SiC)substrate comprising a first conductivity type substrate and a firstconductivity type drift layer, forming a second conductivity type wellregion by performing a second conductivity type implantation through afirst patterned hard mask layer on the SiC substrate, forming a firstconductivity type source region by performing a first conductivity typeimplantation through a second patterned hard mask layer on the SiCsubstrate, forming a second conductivity type well contact region, byperforming a subsequent second conductivity type implantation through athird patterned hard mask layer, meandering at respective locations onthe SiC substrate, and forming a vertical Silicon Carbide (SiC)double-implantation metal oxide semiconductor field-effect transistor(DMOSFET) comprising a drain terminal on a backside of the SiC substrateand a source terminal on a topside of the SiC substrate.

In an embodiment, the second conductivity type well contact regioncomprises a periodic contact with a source metal via a silicide layerbetween an adjacent interlayer dielectric (ILD) region.

In another embodiment, forming the second conductivity type well contactregion enables the second conductivity type well region in contact witha silicide layer through (a) the second conductivity type well contactregion and (b) a periodic spacing between the second conductivity typewell contact region and the first conductivity type source region

In yet another embodiment, forming the second conductivity type wellcontact region enables the second conductivity type well region incontact with a silicide layer through the second conductivity type wellcontact region alone.

In yet another embodiment, forming the second conductivity type wellcontact region at respective locations on the SiC substrate is performedby controlling a size of the second conductivity type well contactregion to a target size, and controlling a spacing between adjacentjunction points located between the second conductivity type wellcontact region to a target spacing, and a silicide layer between anadjacent ILD region.

In yet another embodiment, the target size ranges from 10 nm to 10 μmand the target spacing ranges from 10 nm to 10 μm.

BRIEF DESCRIPTION OF THE FIGURES

The embodiments are illustrated by way of example and not limitation inthe figures of the accompanying drawings, in which like referencesindicate similar elements and in which:

FIG. 1a illustrates an embodiment of a cross sectional structure of aunit cell of a double-implantation metal oxide semiconductorfield-effect transistor (DMOSFET) comprising a first conductivity typesecond source region within a first conductivity type first sourceregion.

FIG. 1b illustrates an embodiment of a cross sectional structure of oneor more unit cells of the DMOSFET, comprising one or more unit cells ofan integrated Schottky diode, each DMOSFET unit cell comprising thefirst conductivity type second source region within the firstconductivity type first source region.

FIG. 1c illustrates an embodiment of a cross sectional structure of oneor more unit cells of a trench gate MOSFET, comprising one or more unitcells of the integrated Schottky diode, each MOSFET unit cell comprisingthe first conductivity type second source region within the firstconductivity type first source region.

FIGS. 2a-2t illustrates an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 1 a.

FIG. 3a illustrates an embodiment of a voltage-current characteristic ofa SiC DMOSFET with conventional p-n junction vs the SiC DMOSFET withdeactivated p-n junction (i.e. the first conductivity type second sourceregion).

FIG. 3b is a perspective view that illustrates an embodiment of sides ofthe DMOSFET in relation to a dice.

FIGS. 3c-3d illustrate current flow paths through the MOSFET and throughan intrinsic anti-parallel diode region in an H-bridge circuitrespectively.

FIG. 4a illustrates an embodiment of a cross sectional structure of aunit cell of a double-implantation metal oxide semiconductorfield-effect transistor (DMOSFET) comprising a first conductivity typesecond source region within a first conductivity type first sourceregion.

FIG. 4b illustrates an embodiment of a cross sectional structure of oneor more unit cells of the DMOSFET, comprising one or more unit cells ofan integrated Schottky diode, each DMOSFET unit cell comprising thefirst conductivity type second source region within the firstconductivity type first source region.

FIGS. 5a-5t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 4 a.

FIG. 6a illustrates an embodiment of a cross sectional structure of aunit cell of a double-implantation metal oxide semiconductor fieldeffect transistor (DMOSFET) comprising a first metal region in directcontact with a second conductivity type well contact region.

FIG. 6b illustrates an embodiment of a cross sectional structure of oneor more unit cells of the DMOSFET, comprising one or more unit cells ofan integrated Schottky diode, each DMOSFET unit cell comprising thefirst metal region in direct contact with the respective secondconductivity type well contact region.

FIG. 6c illustrates an embodiment of a third quadrant current conductionthrough an intrinsic p-n junction diode region vs a Schottky dioderegion connected in parallel to the DMOSFET.

FIG. 6d illustrates an embodiment of a third quadrant current conductionthrough the DMOSFET after connecting the one or more Schottky dioderegions in series with the one or more body diode regions of theDMOSFET.

FIGS. 7a-7x illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 6 a.

FIGS. 8a-8c illustrate an embodiment of cross-sectional structures of aunit cell of a double-implantation metal oxide semiconductor fieldeffect transistor (DMOSFET) comprising a second conductivity type wellcontact region that meanders at three different locations respectively.

FIGS. 8d-8f illustrates an embodiment of cross-sectional structures ofone or more unit cells of a diode integrated DMOSFET, each DMOSFET unitcell comprising the second conductivity type well contact region thatmeanders at three different locations respectively.

FIGS. 9a-9t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 8 a.

FIGS. 10a-10t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 8 b.

FIG. 11a-11t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 8 c.

FIGS. 12a-12c illustrate an embodiment of cross sectional structures ofa unit cell of a double-implantation metal oxide semiconductor fieldeffect transistor (DMOSFET) comprising a second conductivity type wellcontact region that meanders at three different locations respectively,allowing a second conductivity type well region to be in contact with asource metal only through the second conductivity type well contactregion.

FIGS. 12d-12f illustrate an embodiment of cross sectional structures ofone or more unit cells of a diode integrated DMOSFET, each DMOSFET unitcell comprising the second conductivity type well contact region thatmeanders at three different locations respectively, allowing the secondconductivity type well region to be in contact with the source metalonly through the second conductivity type well contact region.

FIG. 12g illustrates an embodiment of a cross sectional structure of oneor more unit cells of a diode integrated trench gate MOSFET, comprisingone or more unit cells of an integrated Schottky diode, each MOSFET unitcell comprising the second conductivity type well contact region at thefirst location, allowing the second conductivity type well region to bein contact with the source metal only through the second conductivitytype well contact region.

FIGS. 13a-13t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 12 a.

FIGS. 14a-14t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 12 b.

FIGS. 15a-15t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 12 c.

Other features of the present embodiments will be apparent from theaccompanying drawings and from the detailed description that follows.

DETAILED DESCRIPTION Definitions and General Techniques

Unless otherwise defined herein, scientific and technical terms usedherein shall have the meanings that are commonly understood by those ofordinary skill in the art. Further, unless otherwise required bycontext, singular terms shall include pluralities and plural terms shallinclude the singular. Generally, nomenclatures used in connection with,and techniques of, semiconductor processing described herein are thosewell-known and commonly used in the art.

The methods and techniques described herein are generally performedaccording to conventional methods well known in the art and as describedin various general and more specific references that are cited anddiscussed throughout the present specification unless otherwiseindicated. The nomenclatures used in connection with, and the proceduresand techniques of semiconductor device technology, semiconductorprocessing, and other related fields described herein are thosewell-known and commonly used in the art.

For simplicity and clarity of illustration, the drawing figuresillustrate the general manner of construction, and descriptions anddetails of well-known features and techniques may be omitted to avoidunnecessarily obscuring the present disclosure. Additionally, elementsin the drawing figures are not necessarily drawn to scale. For example,the dimensions of some of the elements in the figures may be exaggeratedrelative to other elements to help improve understanding of embodimentsof the present disclosure. The same reference numerals in differentfigures denotes the same elements.

The terms “first,” “second,” “third,” “fourth,” and the like in thedescription and in the claims, if any, are used for distinguishingbetween similar elements and not necessarily for describing a particularsequential or chronological order. It is to be understood that the termsso used are interchangeable under appropriate circumstances such thatthe embodiments described herein are, for example, capable of operationin sequences other than those illustrated or otherwise described herein.Furthermore, the terms “include,” and “have,” and any variationsthereof, are intended to cover a non-exclusive inclusion, such that aprocess, method, system, article, device, or apparatus that comprises alist of elements is not necessarily limited to those elements, but mayinclude other elements not expressly listed or inherent to such process,method, system, article, device, or apparatus.

The terms “left,” “right,” “front,” “back,” “top,” “bottom,” “over,”“under,” and the like in the description and in the claims, if any, areused for descriptive purposes and not necessarily for describingpermanent relative positions. It is to be understood that the terms soused are interchangeable under appropriate circumstances such that theembodiments of the apparatus, methods, and/or articles of manufacturedescribed herein are, for example, capable of operation in otherorientations than those illustrated or otherwise described herein.

The following terms and phrases, unless otherwise indicated, shall beunderstood to have the following meanings.

The term “unit cell” as used herein refers to a piece of a pattern in asemiconductor which is repeated in the semiconductor.

The term “SiC” as used herein refers to silicon carbide which is acompound semiconductor and is a mixture of silicon and carbon with thechemical formula SiC. Silicon is covalently bonded with carbon. In4H-SiC, 4H is written in the Ramsdell classification scheme where thenumber indicates the layer and the letter indicates the Bravais lattice.That means in a 4H-SiC structure four hexagonal layers of SiC arepresent. SiC exists in a kind of polymorphic crystalline building knownas a polytype, e.g. 3C-SiC, 4H-SiC, 6H-SiC. Presently 4H-SiC is used inpower device manufacturing.

The term “substrate” as used herein refers to the supporting material onor in which the components of an integrated circuit are fabricated orattached.

The term “JFET” as used herein refers to junction gate field-effecttransistor which is a three-terminal semiconductor device that can beused as electronically-controlled switches, amplifiers, orvoltage-controlled resistors. A FET (field-effect transistor) is aunipolar transistor in which current carriers are injected at a sourceterminal and pass to a drain terminal through a channel of semiconductormaterial whose conductivity depends largely on an electric field appliedto the semiconductor from a control electrode. There are two main typesof FETs, a junction FET and an insulated-gate FET. In the junction FET,the gate is isolated from the channel by a p-n junction. In aninsulated-gate FET, the gate is isolated from the channel by aninsulating layer so that the gate and channel form a capacitor with theinsulating layer as the capacitor dielectric.

The term “MOSFET” as used herein refers to metal oxide semiconductorfield-effect transistor. which is a four-terminal device with source(S), gate (G), drain (D) and body (B) terminals. The body of the MOSFETis frequently connected to the source terminal so making it athree-terminal device like field effect transistor.

The term “DMOSFET” as used herein refers to double-implantation metaloxide semiconductor field-effect transistor. A common physical structureof SiC MOSFETs is the planar double-implanted MOSFET in 4H-SiC(SiC-DMOSFET).

The term “dopant” as used herein refers to an impurity added from anexternal source to a material by diffusion, coating, or implanting intoa substrate, and changing the properties thereof. In semiconductortechnology, an impurity may be added to a semiconductor to modify itselectrical properties or to a material to produce a semiconductor havingdesired electrical properties. N-type (negative) dopants (e.g., such asphosphorus for a group IV semiconductor) typically come from group V ofthe periodic table. When added to a semiconductor, n-type dopants createa material that contains conduction electrons. P-type (positive) dopants(e.g., such as boron for a group IV semiconductor) typically come fromgroup III and result in conduction holes (i.e., vacancies in theelectron shells).

The term “drain” as used herein refers to the electrode of a fieldeffect transistor which receives charge carriers which pass through thetransistor channel from the source electrode.

The term “source” as used herein refers to the active region/electrodeto which the source of charge carriers is connected in a field effecttransistor.

The term “gate” as used herein refers to the control electrode orcontrol region that exerts an effect on a semiconductor region directlyassociated therewith, such that the conductivity characteristic of thesemiconductor region is altered in a temporary manner, often resultingin an on-off type switching action. The control electrode or controlregion of a field effect transistor is located between the source anddrain electrodes, and regions thereof.

The term “topside” as used herein refers to outer side/top of theDMOSFET. The topside of the vertical SiC DMOSFET may comprise a sourceterminal.

The term “bottom side” as used herein refers to underside/base of theDMOSFET. The bottom side of the vertical SiC DMOSFET may comprise adrain terminal.

The term “front side” as used herein refers to a side of the DMOSFETwhich is visible in front.

The term “back side” as used herein refers to rear side of the DMOSFET.The back side of the vertical SiC DMOSFET may comprise the drainterminal.

The term “impurity” as used herein refers to a foreign material presentin a semiconductor crystal, such as boron or arsenic in silicon, whichis added to the semiconductor to produce either p-type or n-typesemiconductor material, or to otherwise result in material whoseelectrical characteristics depend on the impurity dopant atoms.

The term “PN junction” as used herein refers to the interface and regionof transition between p-type and n-type semiconductors.

The term “polysilicon” as used herein refers to a polycrystalline formof silicon.

The term “p-type” as used herein refers to extrinsic semiconductor inwhich the hole density exceeds the conduction electron density.

The term “bandgap” as used herein refers to the difference between theenergy levels of electrons bound to their nuclei (valence electrons) andthe energy levels that allow electrons to migrate freely (conductionelectrons). The band gap depends on the particular semiconductorinvolved.

The term “channel” as used herein refers to a path for conductingcurrent between a source and drain of a field effect transistor.

The term “chip” as used herein refers to a single crystal substrate ofsemiconductor material on which one or more active or passivesolid-state electronic devices are formed. A chip may contain anintegrated circuit. A chip is not normally ready for use until packagedand provided with external connectors.

The term “contact” as used herein refers to the point or part of aconductor which touches another electrical conductor or electricalcomponent to carry electrical current to or from the conductor orelectrical component.

The term “drift layer” as used herein refers to lightly doped region tosupport the high voltage in power DMOSFET.

The term “well” used herein refers certain regions in ametal-oxide-semiconductor (MOS) transistor. MOS transistors are alwayscreated in a “well” region. A PMOS (positive-channel MOS) transistor ismade in an N-doped region, called “n-well” region. Similarly, an NMOStransistor (negative-channel MOS) is made in a “p-type” region called“p-well”. This ensures that the leakage between two transistors, throughthe bottom side, is low due to the reverse bias between the transistorareas and the well region.

The term “plus” used herein refers certain regions in ametal-oxide-semiconductor (MOS) transistor where doping concentration isexcessive.

The term “source interconnect metallization” as used herein refers tointerconnection metallization that interconnects many DMOSFETs usingfine-line metal patterns.

The term “device” as used herein refers to the physical realization ofan individual electrical element in a physically independent body whichcannot be further divided without destroying its stated function.

The term “surface” as used herein refers to the outer or exteriorboundary of a thing.

The term “trench” as used herein refers to electrical isolation ofelectronic components in a monolithic integrated circuit by the use ofgrooves or other indentations in the surface of the substrate, which mayor may not be filled with electrically insulative (i.e., dielectric)material.

The term “dielectric” as used herein refers to a non-conductor ofelectricity, otherwise known as an insulator.

The term “ILD” as used herein refers to interlayer dielectric materialused to electrically separate closely spaced interconnect lines arrangedin several levels (multilevel metallization) in an advanced integratedcircuit.

The term “active region” as used herein refers to a region of theDMOSFET where the current conduction happens.

The term “depletion region” as used herein refers to a region where flowof charged carriers decreases over a given time.

The term “thermal budget” as used herein refers to total amount ofthermal energy transferred to a wafer during the given elevatedtemperature operation.

The term “work function” as used herein refers to minimum quantity ofenergy required to remove an electron to infinity from the surface of agiven metal.

The terms “first conductivity type region” and “second conductivity typeregion” as used herein, are used to describe n-type and p-type regionsrespectively for a N type device. For a P type device “firstconductivity type region” and “second conductivity type region” are usedto describe p-type and n-type regions respectively

Embodiments relate to silicon carbide (SiC) DMOSFET power devices havingincreased third quadrant cross over current.

An embodiment relates to tuning turn-on voltage of one or more bodydiode regions of the DMOSFET.

An embodiment relates to reducing injection of minority carriers duringconduction of the one or more body diode regions.

An embodiment relates to tuning source contact resistance of the one ormore body diode regions of the DMOSFET.

An embodiment relates to improved device reliability.

An embodiment relates to reducing differential ON resistance for a givenchip size.

An embodiment relates to mitigate basal plane dislocation (BPD).

An embodiment relates to formation of a first conductivity type secondsource region between a silicide layer and a second conductivity typewell region of the DMOSFET.

An embodiment relates to formation of a first metal region in directcontact with a second conductivity type well contact region.

An embodiment relates to connecting one or more Schottky diode regionsin series with the one or more body diode regions of the DMOSFET.

An embodiment relates to formation of the second conductivity type wellcontact region that meanders and comprise a periodic spacing between thefirst conductivity type source region and the second conductivity typewell contact region.

An embodiment relates to formation of the second conductivity type wellcontact region that meanders and enables the second conductivity typewell region to be contact in with a source metal only through the secondconductivity type well contact region.

An embodiment relates to a power DMOSFET device structure designed tohandle significant power level includes an intrinsic anti-parallel p-njunction diode, formed between the body and well regions, respectively.The anti-parallel p-n junction diode within the power DMOSFET structureconducts during third quadrant operation of the power DMOSFET. The thirdquadrant operation occurs when source terminal is biased positively withrespect to drain terminal, a situation that is commonly encountered whenpower MOSFETs are utilized in motor control related power conversionapplications. To circumvent performance and reliability issues relatedto slower switching speed of the p-n diode and conversion of the basalplane dislocations into stacking faults, respectively, a Schottky diodeis either externally or internally connected in an anti-parallel withthe intrinsic p-n body diode of the DMOSFET. In this scenario, thereexists a specific cross-over current, above which the current stillflows mainly through the p-n diode, despite the connection of theSchottky diode.

An embodiment relates to a Silicon Carbide (SiC) double-implantationmetal oxide semiconductor field effect transistor (DMOSFET) withincreased cross over current. The magnitude of the cross over current ofthe DMOSFET is increased by at least one of increasing built-inpotential (e.g. turn-on voltage) of the one or more body diode regionsof the DMOSFET and reducing injection of minority carriers duringconduction of the one or more body diode regions. In an embodiment, theSiC DMOSFET is a n-type planar gate DMOSFET. In another embodiment, theSiC DMOSFET is a p-type planar gate DMOSFET. In yet another embodiment,the SiC DMOSFET is a n-type trench gate DMOSFET. In yet anotherembodiment, the SiC DMOSFET is a p-type trench gate DMOSFET. Themagnitude of the cross over current is increased by performing belowembodiments. The below embodiments are described specifically withrespect to the n-type planar gate DMOSFET.

In one embodiment, each unit cell of the DMOSFET comprises a second N+source region between a silicide layer and a p-well region to impact theturn-on voltage of the one or more body diode regions of the DMOSFET.

In another embodiment, each unit cell of the DMOSFET comprises a firstmetal region in direct contact with a P+ region to connect one or moreSchottky diode regions in series with the one or more body diode regionsof the DMOSFET to impact the turn-on voltage of the one or more bodydiode regions of the DMOSFET.

In yet another embodiment, each unit cell of the DMOSFET comprises theP+ region that meanders and comprises a periodic spacing between a N+source region and the P+ region to form periodic contacts to a first padmetal (e.g. a source metal) via the silicide layer between interlayerdielectric bumps (ILD) to impact the differential on-resistance of theone or more body diode regions of the DMOSFET.

In yet another embodiment, each unit cell of the DMOSFET comprises theP+ region that meanders and enables the P-well region to be in contactwith the silicide layer (i.e. the first pad metal) only through themeandering P+ region to impact the differential on-resistance of the oneor more body diode regions of the DMOSFET.

FIG. 1a illustrates an embodiment of a cross sectional structure of aunit cell of a double-implantation metal oxide semiconductorfield-effect transistor (DMOSFET) comprising a first conductivity typesecond source region within a first conductivity type first sourceregion. The DMOSFET (shown in FIG. 1a ) is a n-type planar gate DMOSFET.In an embodiment, the DMOSFET is a p-type planar gate DMOSFET. TheDMOSFET (shown in FIG. 1a ) comprises a silicon carbide (SiC) substrate.The SiC substrate comprises a N+ substrate 102 and a N− drift layer 104.The DMOSFET also comprises a P-well region 106, a first N+ source region108 (i.e. the first conductivity type first source region) and a secondN+ source region 110 (i.e. the first conductivity type second sourceregion). The first N+ source region 108 is formed within the P-wellregion 106. The second N+ source region 110 is formed within each firstN+ source region 108 by etching the SiC substrate to remove a portion ofthe SiC substrate and form a recessed SiC trench 112. In an embodiment,the second N+ source region 110 is a depletion region when the DMOSFETis operated in the third quadrant. The recessed SiC trench 112 leavesthe remnant thin first N+ source region 108 as the second N+ sourceregion 110. The second N+ source region 110 comprises a thickness lessthan a thickness of the first N+ source region 108 which enables thesecond N+ source region 110 to get depleted easily compared to the firstN+ source region 108. The second N+ source region 110 may comprise thethickness ranging from 1% to 90% lower than the thickness of the firstN+ source region 108. In an embodiment, the second N+ source region 110comprises a doping concentration less than a doping concentration of thefirst N+ source region 108. The second N+ source region 110 may comprisethe doping concentration ranging from 1% to 90% lower than the dopingconcentration of the first N+ source region 108.

The DMOSFET also comprises a gate insulator 114, a polysilicon layer 116and an interlayer dielectric (ILD) 118 on both sides of top surface ofthe SiC substrate. The DMOSFET further comprises a first silicide layer120 on top of the recessed SiC trench 112 and a second silicide layer122 on bottom side/back side of the SiC substrate to form ohmic contactsfor a source terminal and a drain terminal respectively. The DMOSFETfurther comprises a first pad metal 124 (e.g. a source metal) and asecond pad metal 126 (e.g. a drain metal) on top of the first silicidelayer 120 and bottom of the second silicide layer 122 respectively.

During third quadrant operation of the n-type planar gate DMOSFET (i.e.when the source terminal is positively biased with respect to the drainterminal), an intrinsic p-n junction between the second N+ source region110 and the p-well region 106 is reverse biased as electric potential ofthe first pad metal 124 is low when compared to electric potential ofthe second pad metal 126. The second N+ source region 110 startsdepleting during the third quadrant operation. The first pad metal 124(e.g. the source metal) is directly short circuited (e.g. connected)with the P-well region 106, when the second N+ source region 110 iscompletely depleted. The second N+ source region 110 enables one or morebody diode regions of the DMOSFET to have an increased turn-on voltageand the one or more body diode regions turn on only when the second N+source region 110 is completely depleted. The increased turn-on voltageis due to intrinsic bandgap of the SiC. As the complete depletion of thesecond N+ source region 110 depends on at least one of the thickness andthe doping concentration of the second N+ source region 110, the turn-onvoltage of the second N+ source region 110 also depends on the thicknessand the doping concentration of the second N+ source region 110. Theturn-on voltage of the one or more body diode regions is tuned bycontrolling/adjusting the thickness and the doping concentration of thesecond N+ source region 110 to a target thickness and a target dopingconcentration respectively. In an embodiment, the target thicknessranges from 1 nm to 1 μm. In another embodiment, the target dopingconcentration ranges from 10¹⁵ cm⁻³ to 10²¹ cm⁻³. The target thicknessand the target doping concentration of the second N+ source region 110is achieved by monitoring and controlling precisely the etchingperformed onto the SiC substrate.

FIG. 1b illustrates an embodiment of a cross sectional structure of oneor more unit cells of the DMOSFET, comprising one or more unit cells ofan integrated Schottky diode, each DMOSFET unit cell comprising thefirst conductivity type second source region within the firstconductivity type first source region. The DMOSFET (shown in FIG. 1b )is a n-type planar gate SiC DMOSFET. The DMOSFET shown in FIG. 1boperates in a similar way to FIG. 1 a. In addition to FIG. 1 a, theDMOSFET (shown in FIG. 1b ) comprises a metal region 128 (e.g. aSchottky metal region 128) in direct contact with the N− drift layer 104and bridges adjacent P-well regions 106 (i.e. bridges the adjacent unitcells) of the one or more P-well regions 106. The DMOSFET comprises eachsecond N+ source region 110 between the respective silicide SiC trench112 and the respective P-well region 106.

FIG. 1c illustrates an embodiment of a cross sectional structure of oneor more unit cells of a trench gate MOSFET, comprising one or more unitcells of the integrated Schottky diode, each MOSFET unit cell comprisingthe first conductivity type second source region within the firstconductivity type first source region. The trench gate MOSFET shown inFIG. 1c is a n-type trench gate SiC MOSFET. In an embodiment, the trenchgate MOSFET is a p-type trench gate SiC MOSFET. The trench gate MOSFETshown in FIG. 1c operates in a similar way to planar gate DMOSFET shownin FIG. 1a and FIG. 1 b. The main difference between the trench gateMOSFET and the planar gate DMOSFET is that the trench gate MOSFETcomprises one or more trench gate structures instead of one or moreplanar gate structures. The one or more trench gate structures of thetrench gate MOSFET comprises sidewalls that are exposing to the first N+source region 108 and the one or more P-well regions 106. The bottom ofthe one or more trench gate structures is in vicinity of the bottom ofthe one or more P-well regions 106. In an embodiment, the bottom of theone or more trench gate structures is adjusted appropriately dependingon electrical properties of the MOSFET device. Each trench gatestructure of the trench gate MOSFET comprises the gate insulator 114 asliner along the sidewall and the bottom of the respective trench gatestructure. Each trench gate structure comprises the polysilicon layer116 that fills the gate-insulator lined trenches and serves as gateelectrode. The trench gate MOSFET further comprises the interlayerdielectric (ILD) 118 over each polysilicon layer 116 to open shortcircuitry between the first pad metal 124 (e.g. the source metal) andthe gate electrode.

FIGS. 2a-2t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 1 a. The process of manufacturing theDMOSFET structure (shown in FIG. 1a ) comprises preparing a SiliconCarbide (SiC) substrate having a N+ substrate 202 and a N− drift layer204 as shown in FIG. 2 a. The N− drift layer 204 of the SiC substrate isepi-grown and prepared such that a doping concentration and a thicknessof the N− drift layer 204 are selected primarily based on blockingvoltage and forward conduction loss. The N+ substrate 202 is highlyconductive when compared to the N− drift layer 204 and the N+ substrate202 is in direct contact with the N− drift layer 204. A first patternedhard mask layer 205 is formed on top of the SiC substrate as shown inFIG. 2 b. The first patterned hard mask layer 205 is thick enough forcompletely blocking high energy impurities during implantation. In anembodiment, the first patterned hard mask layer 205 is a hard mask of atleast one of oxide, nitride and a polysilicon.

A first p-type ion implantation is formed in FIG. 2c through the firstpatterned hard mask layer 205 to form a p-well region 206. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 205 is then removed, afterthe first p-type ion implantation, by at least one of dry etching andwet etching process as shown in FIG. 2 d. A second patterned hard masklayer 207 is then formed on the top of the SiC substrate as shown inFIG. 2e for subsequent ion implantation. The second patterned hard masklayer 207 is a photoresist based material and thick enough forpreventing any unwanted high energy impurity particles penetrating thesecond patterned hard mask layer 207. A first n-type ion implantation isperformed through the second patterned hard mask layer 207 to form afirst N+ source region 208 within the p-well region 206 as shown in FIG.2 f. In an embodiment, the first n-type ion implantation is performedwith one or more n-type impurities (e.g. nitrogen, phosphorous etc.).The second patterned hard mask layer 207 is then removed after the firstn-type ion implantation by at least one of dry etching and wet etchingprocess as shown in FIG. 2 g.

A third patterned hard mask layer 209 is formed on top of the SiCsubstrate as shown in FIG. 2 h. An etching is performed onto the SiCsubstrate through the third patterned hard mask layer 209. The SiCetching performed consumes a central portion of each first N+ sourceregion 208 and forms a recessed SiC trench region 212 per each first N+source region 208. The recessed SiC trench region 212 does not fullypenetrates the first N+ source region 208 in vertical direction andleaves a remnant of the first N+ source region 208 to form a second N+source region 210 under the bottom of the recessed SiC trench region 212as shown in FIG. 2 i. The SiC etching is controlled accurately andprecisely considering plausible loss of the Sic Substrate, during atleast one of thermal activation annealing, sacrificial oxidation and dryoxidation for one of a gate oxide formation and a silicide layerformation for ohmic contacts, when target SiC trench depth is reached.The target SiC trench depth leaves at least one of a target thicknessand a target doping concentration of the second N+ source region 210under the bottom of the recessed SiC trench region 212. In anembodiment, the target thickness ranges from 1 nm to 1 μm. In anotherembodiment, the target doping concentration ranges from 10¹⁵ cm⁻³ to10²¹ cm⁻³.

The third patterned hard mask layer 209 is then removed as shown in FIG.2j by at least one of a dry etching and a wet etching process once thetarget SiC trench depth is reached. The SiC substrate undergoes thermalactivation annealing with a carbon-based protection coating at apredefined temperature. In an embodiment, the predefined temperature is1700-degree Celsius. The SiC substrate then may undergo an additionalion implantation for forming a current spreading layer to improveon-state resistance. Ion implantations (e.g. the first p-typeimplantation, the first n-type impanation, the second p-typeimplantation, edge termination implantation, current spreading layerimplantation etc.) undergone by the SiC substrate is performed prior tothe thermal activation annealing step. The carbon-based protectioncoating is then removed from the SiC substrate once the thermalactivation annealing is completed. The SiC substrate then undergoes asacrificial oxide growth and subsequently the sacrificial oxide removal.An active region of the DMOSFET is then patterned by forming andpatterning field oxide layer on the SiC substrate.

A gate insulator 214 is then deposited/formed on top of the SiCsubstrate as shown in FIG. 2 k. The gate insulator 214 is then patternedas shown in FIG. 2 l. A polysilicon layer 216 is then formed on top ofthe SiC substrate as shown in FIG. 2 m. The polysilicon layer 216 isthen patterned as shown in FIG. 2 n. The contacts for the polysiliconlayer are kept open before pad metal deposition for forming a gate padregion and the gate bus region(s). An interlayer dielectric (ILD) 218 isthen formed on top of the SiC substrate as shown in FIG. 2 o. Theinterlayer dielectric (ILD) 218 is then patterned for exposing theportions of the SiC substrate via the openings of the ILD 218 as shownin FIG. 2 p. A first silicide layer 220 is then formed on the exposedportions on top of the SiC substrate for forming a first Ohmic contact(e.g. a source terminal contact) as shown in FIG. 2 q. In an embodiment,the first silicide layer 220 is a nickel-based silicide layer. Inanother embodiment, the nickel-based silicide is formed by Nickeldeposition on the top of the SiC substrate, thermal activation annealingof the deposited Nickel for silicide formation, and removal of anyun-reacted Nickel from the SiC substrate. A first pad metal 224 is thenformed on top of the first silicide layer 220 of the SiC substrate asshown in FIG. 2 r.

A second silicide layer 222 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 2 s. In anembodiment, the second silicide layer 222 is then formed on back of theSiC substrate for forming the second Ohmic contact (e.g. a drainterminal contact). In an embodiment, the second silicide layer 222 isalso the nickel-based silicide layer. A second pad metal 226 is thenformed on bottom of the second silicide layer 222 of the SiC substrateas shown in FIG. 2 t. In an embodiment, the second pad metal formationis performed by at least one of e-beam and sputtering.

A fourth patterned hard mask layer 211 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 211 is formed forselectively removing the exposed portions of the ILD layer 218 andforming a metal region (i.e. a Schottky metal region 228) shown in FIG.1 b. The fourth patterned hard mask layer 211 is used for both etchingthe portion of the ILD layer 218 and lifting off the Schottky metalregion 228 when Schottky metal is deposited. The Schottky metal region228 is in direct contact with the N− drift layer 204 and bridge twoadjacent P-well regions 206 (i.e. bridges the adjacent unit cells). TheSchottky metal region 228 is then annealed with a predefined thermalbudget for forming a Schottky metal contact between the Schottky metalregion 228 and the portion of the N− drift layer 204 exposed at the topsurface of the SiC substrate. In an embodiment, the predefined thermalbudget ranges from 55° C. to 1100° C. In FIG. 1b the first pad metal andthe second pad metal formation are performed once the Schottky metalregion 228 formation is completed.

FIG. 3a illustrates an embodiment of a voltage-current characteristic ofa SiC DMOSFET with conventional p-n junction vs the SiC DMOSFET withdeactivated p-n junction (i.e. the first conductivity type second sourceregion). The voltage-current characteristic shown in FIG. 3a depictsthat at a drain current −16 A, the SiC planar DMOSFET with conventionalp-n junction shows a voltage drop of ≈−4 v and the SiC DMOSFET withdeactivated p-n junction (i.e. the first conductivity type second sourceregion) shows a voltage drop of ≈−7 V. The SiC DMOSFET comprise the p-njunction with increased built-in potential and increased differentialon-resistance when the SiC DMOSFET comprises the first conductivity typesecond source region 110.

FIG. 3b is a perspective view that illustrates an embodiment of sides ofthe DMOSFET in relation to a dice. The DMOSFET may comprise a structuresimilar to the dice as shown in FIG. 3 b. The DMOSFET comprises at leastthe topside 340, the bottom side 342, a front side 344, the back side346, a left side 348 and a right side 350. The topside 340 of theDMOSFET refers to an outer side/top of the DMOSFET. The topside 340comprises the source terminal. The bottom side 342 refers to a base ofthe DMOSFET. In an embodiment, the bottom side 342 of the DMOSFETcomprises the drain terminal. The back side 346 of the DMOSFET is hiddenin the FIG. 3b and is located in adjacent to the topside 340 and thebottom side 342. In another embodiment, the back side 346 of the DMOSFETcomprises the drain terminal. The front side 344 and the right side 350of the DMOSFET is visible in the FIG. 3 b, whereas the left side 348 andthe back side 346 of the DMOSFET is hidden in the FIG. 3 b.

FIGS. 3c-3d shows the operation of the anti-parallel diode in ahalf-bridge inverter feeding an inductive load. The left picture (i.e.FIG. 3c ) shows the state when the upper switch feeds the inductor.However, when that switch turns off, inductor's current continues itspath through the anti-parallel diode of the bottom switch (right picturei.e. FIG. 3d ).” [source: Re: Why are diodes connected anti-parallelacross the MOSFET or IGBT in Inverter Module? Heydari, Gholamali,published on Research gate, Jul. 25, 2013].

FIG. 4a illustrates an embodiment of a cross sectional structure of aunit cell of a double-implantation metal oxide semiconductorfield-effect transistor (DMOSFET) comprising a first conductivity typesecond source region within a first conductivity type first sourceregion. The DMOSFET (shown in FIG. 4a ) is a n-type planar gate DMOSFET.In an embodiment, the DMOSFET is a p-type planar gate DMOSFET. Inanother embodiment, the DMOSFET is one of a n-type trench gate DMOSFETand a p-type trench gate DMOSFET. The DMOSFET (shown in FIG. 4a )comprises a Silicon Carbide (SiC) substrate. The SiC substrate comprisesa N+ substrate 402 and a N− drift layer 404. The DMOSFET also comprisesa P-well region 406, a first N+ source region 408 (i.e. the firstconductivity type first source region) and a second N+ source region 410(i.e. the first conductivity type second source region). The first N+source region 408 is formed within the P-well region 406. The second N+source region 410 is formed within the first N+ source region 408 byperforming a n-type implantation with controlled dosage and energylevel. In an embodiment, the second N+ source region 410 is a depletionregion during third quadrant MOSFET operation. The second N+ sourceregion 410 comprises a thickness and a doping concentration which issignificantly less than a thickness and a doping concentration of thefirst N+ source region 408 respectively which enables the second N+source region 410 to get depleted easily compared to the first N+ sourceregion 408. In an embodiment, the second N+ source region 410 comprisesthe thickness ranging from 1% to 90% lower than the thickness of thefirst N+ source region 408. In another embodiment, the second N+ sourceregion 410 comprises the doping concentration ranging from 1% to 90%lower than the doping concentration of the first N+ source region 408.

The DMOSFET also comprises a gate insulator 414, a polysilicon layer 416and an interlayer dielectric (ILD) 418 on both sides of top surface ofthe SiC substrate. The DMOSFET further comprises a first silicide layer420 on top of the SiC substrate and a second silicide layer 422 onbottom side/back side of the SiC substrate to form ohmic contacts for asource terminal and a drain terminal respectively. The DMOSFET furthercomprises a first pad metal 424 (e.g. a source metal) and a second padmetal 426 (e.g. a drain metal) on top of the first silicide layer 420and bottom of the second silicide layer 422 respectively.

During third quadrant operation of the DMOSFET (i.e. when the sourceterminal is positively biased with respect to the drain terminal), anintrinsic p-n junction between the second N+ source region 410 and thep-well region 406 is reverse biased as electric potential of the firstpad metal 424 is low when compared to electric potential of the secondpad metal 426. The second N+ source region 410 starts depleting duringthe third quadrant operation. The first pad metal 424 (e.g. the sourcemetal) is directly short circuited (i.e. connected) with the P-wellregion 406, when the second N+ source region 410 is completely depleted.The second N+ source region 410 enables one or more body diode regionsof the DMOSFET to have an increased turn-on voltage and the one or morebody diode regions turn on only when the second N+ source region 410 iscompletely depleted. The increased turn-on voltage is due to intrinsicbandgap of the SiC. As the complete depletion of the second N+ sourceregion 410 depends on at least one of a thickness and a dopingconcentration of the second N+ source region 410, the turn-on voltage ofthe one or more body diode regions also depends on the thickness and thedoping concentration of the second N+ source region 410. The turn-onvoltage of the one or more body diode regions is tuned bycontrolling/adjusting the thickness and the doping concentration of thesecond N+ source region 410 to a target thickness and a target dopingconcentration respectively. In an embodiment, the target thicknessranges from 1 nm to 1 μm. In another embodiment, the target dopingconcentration ranges from 10¹⁵ cm⁻³ to 10²¹ cm⁻³. The target thicknessand the target doping concentration of the second N+ source region 410is achieved by monitoring and controlling the dosage and the energylevel of the n-type implantation.

FIG. 4b illustrates an embodiment of a cross sectional structure of oneor more unit cells of the DMOSFET, comprising one or more unit cells ofan integrated Schottky diode, each DMOSFET unit cell comprising thefirst conductivity type second source region within the firstconductivity type first source region. The DMOSFET (shown in FIG. 4b )is a n-type planar gate DMOSFET. The DMOSFET shown in FIG. 4b operatesin a similar way to FIG. 4 a. In addition to FIG. 4 a, the DMOSFET(shown in FIG. 4b ) comprises a metal region (i.e. a Schottky metalregion 428) and one or more P-well regions 406. The Schottky metalregion 428 is in direct contact with the N− drift layer 404 and bridgesthe adjacent P-well regions 406 (i.e. bridges the adjacent unit cells)of the one or more P-well regions 406. The DMOSFET comprises each secondN+ source region 410 between the first silicide layer 420 and therespective P-well region 406.

FIGS. 5a-5t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 4 a. The process of manufacturing theDMOSFET structure (shown in FIG. 5a ) comprises preparing a SiliconCarbide (SiC) substrate having a N+ substrate 502 and a N− drift layer504 as shown in FIG. 5 a. The N− drift layer 504 of the SiC substrate isepi-grown and prepared such that a doping concentration and a thicknessof the N− drift layer 504 are selected primarily based on blockingvoltage and forward conduction loss. The N+ substrate 502 is highlyconductive when compared to the N− drift layer 504 and the N+ substrate502 is in direct contact with the N− drift layer 504. A first patternedhard mask layer 505 is formed on top of the SiC substrate as shown inFIG. 5 b. The first patterned hard mask layer 505 is thick enough forcompletely blocking high energy impurities during implantation. In anembodiment, the first patterned hard mask layer 505 is a hard mask of atleast one of oxide, nitride and a polysilicon.

A first p-type ion implantation is formed in FIG. 5c through the firstpatterned hard mask layer 505 to form a p-well region 506. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 505 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 5 d. A second patternedhard mask layer 507 is then formed on the top of the SiC substrate asshown in FIG. 5e for subsequent ion implantation. The second patternedhard mask layer 507 is a photoresist based material and thick enough forpreventing any unwanted high energy impurities particles penetrating thesecond patterned hard mask layer 507. A first n-type ion implantation isformed through the second patterned hard mask layer 507 to form a firstN+ source region 508 (i.e. the first conductivity type first sourceregion) within the p-well region 506 as shown in FIG. 5 f. In anembodiment, the first n-type ion implantation is performed with one ormore n-type impurities (e.g. nitrogen, phosphorous etc.). The secondpatterned hard mask layer 507 is then removed after the first n-type ionimplantation by at least one of dry etching and wet etching process asshown in FIG. 5 g.

A third patterned hard mask layer 509 is then formed on top of the SiCsubstrate as shown in FIG. 5 h. A second n-type implantation isperformed through the third patterned hard mask layer 509 to form asecond N+ source region 510 within the first N+ source region 508 withineach p-well region 506 as shown in FIG. 5 i. The dosage and energy levelof the second n-type implantation is controlled accurately and preciselyto form the second N+ source region 510 having a target thickness and atarget doping concentration. The target thickness may range from 1 nm to1 μm. The target doping concentration may range from 10¹⁵ cm⁻³ to 10²¹cm⁻³. In an embodiment, a doping concentration and a thickness of thesecond N+ source region 510 is less than a doping concentration and athickness of the first N+ source region 508 respectively. In oneembodiment, the doping concentration of the second N+ source region 510is 1% to 90% lower than the doping concentration of the first N+ sourceregion 508. In another embodiment, the thickness of the second N+ sourceregion 510 is 1% to 90% lower than the thickness of the first N+ sourceregion 508.

The third patterned hard mask layer 509 is then removed as shown in FIG.5j by at least one of a dry etching and a wet etching process once thesecond N+ source region 510 having the target thickness and the targetdoping concentration is achieved. The SiC substrate undergoes thermalactivation annealing with a carbon-based protection coating at apredefined temperature. In an embodiment, the predefined temperature forperforming the thermal activation annealing is 1700-degree Celsius. TheSiC substrate then may undergo an additional ion implantation forforming a current spreading layer to improve on-state resistance. Ionimplantations (e.g. the first p-type implantation, the first n-typeimpanation, the second p-type implantation, edge terminationimplantation, current spreading layer implantation etc.) undergone bythe SiC substrate is performed prior to the thermal activation annealingstep. The carbon-based protection coating is then removed from the SiCsubstrate. The SiC substrate then undergoes a sacrificial oxide growthand subsequently the sacrificial oxide removal. An active region of theSiC DMOSFET is then patterned by forming and patterning field oxidelayer on the SiC substrate.

A gate insulator 514 is then formed on top of the SiC substrate as shownin FIG. 5 k. The gate insulator is then patterned as shown in FIG. 5 l.A polysilicon layer 516 is then formed on top of the SiC substrate asshown in FIG. 5 m. The polysilicon layer 516 is then patterned as shownin FIG. 5 n. Contacts for the polysilicon layer is kept open for padmetal deposition for forming a gate pad region and one or more gate busregions. An interlayer dielectric (ILD) 518 is then formed on top of theSiC substrate as shown in FIG. 5 o. The interlayer dielectric (ILD) 518is then patterned for exposing the portions of the SiC substrate via theopenings of the ILD 518 as shown in FIG. 5 p. A first silicide layer 520is then formed on the exposed portions of top of the SiC substrate forforming a first Ohmic contact (e.g. a source terminal contact) as shownin FIG. 5 q. In an embodiment, the first silicide layer 520 is anickel-based silicide layer. In another embodiment, the nickel-basedsilicide is formed by Nickel deposition on the top of the SiC substrate,thermal activation annealing of the deposited Nickel for silicideformation, and removal of any un-reacted Nickel from the SiC substrate.A first pad metal 524 is then formed on top of the first silicide layer520 of the SiC substrate as shown in FIG. 5 r.

A second silicide layer 522 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact (e.g. a drain terminalcontact) as shown in FIG. 5 s. In an embodiment, the second silicidelayer 522 is then formed on back of the SiC substrate for forming thesecond Ohmic contact (e.g. the drain terminal contact). In anembodiment, the second silicide layer 522 is also the nickel-basedsilicide layer. A second pad metal 526 is then formed on bottom of thesecond silicide layer 522 of the SiC substrate as shown in 5 t. In anembodiment, the second pad metal formation is performed by at least oneof e-beam and sputtering.

A fourth patterned hard mask layer 511 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on top and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 511 is formed forselectively removing the exposed portions of the ILD layer 518 andforming a metal region 528 (i.e. a Schottky metal region 528) shown inFIG. 4 b. The fourth patterned hard mask layer 511 is used for bothetching the portion of the ILD layer 518 and lifting off the Schottkymetal region 528 when Schottky metal is deposited. The Schottky metalregion 528 is in direct contact with the top of the N− drift layer 504and bridge two adjacent P-well regions 506 (e.g. bridges the adjacentunit cells). The Schottky metal region 528 is then annealed with apredefined thermal budget for forming a Schottky metal contact betweenthe second Schottky metal region 528 and the portion of the N− driftlayer 504 exposed at the top surface of the SiC substrate. In anembodiment, the predefined thermal budget ranges from 55° C. to 1100° C.In FIG. 4b the first pad metal and the second pad metal formation areperformed once the Schottky metal region 528 formation is completed.

FIG. 6a illustrates an embodiment of a cross sectional structure of aunit cell of a double-implantation metal oxide semiconductor fieldeffect transistor (DMOSFET) comprising a first metal region in directcontact with a second conductivity type well contact region. The DMOSFET(shown in FIG. 6a ) is a n-type planar gate SiC DMOSFET. In anembodiment, the DMOSFET is a p-type planar gate DMOSFET. In anotherembodiment, the DMOSFET is a p-type trench gate DMOSFET. In yet anotherembodiment, the DMOSFET is a n-type trench gate DMOSFET. The DMOSFET(shown in FIG. 6a ) comprises a Silicon Carbide (SiC) substrate. The SiCsubstrate comprises a N+ substrate 602 and a N− drift layer 604. TheDMOSFET also comprises a P-well region 606, a first N+ source region 608and a P+ region 603 (i.e. the second conductivity type well contactregion). The first N+ source region 608 is formed within the P-wellregion 606. The P+ region 603 (i.e. the second conductivity type wellcontact region) is formed within the P-well region 606 by performing ap-type implantation. The second conductivity type well contact regionspecifically refers to the P+ region 603. The first metal region 613(e.g. a first Schottky metal region 613) is then formed in directcontact with the P+ region 603 to connect one or more Schottky dioderegions in series with one or more body diode regions of the DMOSFET.The first Schottky metal region 613 comprises a target work function. Inan embodiment, the target work function of the first Schottky metalregion 613 ranges from 3.5 electron volts to 6 electron volts. The workfunction of the first Schottky metal region 613 and the seriesconnection of the Schottky diode regions with the body diode regionsallows the one or more body diode regions to turn-on only whensignificant number of carriers from the first Schottky metal region 613is thermionically injected over Schottky barrier during third quadrantoperation of the DMOSFET. Since the one or more Schottky diode regionsare connected in series with the one or more body diode regions, the oneor more Schottky diode regions consumes the voltage of the one or morebody diode regions and the one or more Schottky diode regions turn onfirst before the one or more body diode regions. Any additional appliedvoltage that is greater than turn-on voltage of the one or more Schottkydiode regions contributes to turn-on the one or more body diode regions.Due to the series connection of the one or more Schottky diode regionswith the body diode regions, the body diode regions consume additionalturn-on voltage compared to typical turn-on voltage. The one or morebody diode regions get turn-on only when the first Schottky metal region613 turn on with a forward voltage which corresponds at least to thebarrier height of a first Schottky contact region for starting theon-set of the carrier injection over the Schottky barrier (i.e. when thefirst Schottky metal region 613 comprises the target work function). Theforward voltage initiates the carrier injection to turn-on the Schottkydiode regions. Any additional forward voltage that is greater than theturn-on voltage of the Schottky diode regions contributes to turn-on thebody diode regions. The turn-on voltage of the body diode regions istuned by at least one of controlling a Schottky barrier height andselecting a Schottky metal with an appropriate work function utilized informing the first Schottky metal region 613. The turn-on voltage of thebody diode regions is also tuned by adjusting thermal budget forannealing the first Schottky contact region once the first Schottkymetal region 613 is formed on top of the SiC substrate. The predefinedthermal budget may range from 55° C. to 1100° C. In an embodiment, theDMOSFET comprises a second metal region 628 (e.g. a second Schottkymetal region 628) directly on top of the N− drift layer 604 and bridgeadjacent P-well regions 606 of the one or more P-well regions 606 (i.e.bridges the adjacent unit cells) shown in FIG. 6 b. The work function ofthe first Schottky metal region 613 is less than a work function of thesecond Schottky metal region 628.

FIG. 6b illustrates an embodiment of a cross sectional structure of oneor more unit cells of the DMOSFET, comprising one or more unit cells ofan integrated Schottky diode, each DMOSFET unit cell comprising thefirst metal region in direct contact with the respective secondconductivity type well contact region. The DMOSFET (shown in FIG. 6b )is a n-type planar gate SiC DMOSFET. The DMOSFET shown in FIG. 6boperates in a similar way to FIG. 6 a. In addition to FIG. 6 a, theDMOSFET (shown in FIG. 6b ) comprises the second Schottky metal region628 and one or more P-well regions 606. The second Schottky metal region628 is in direct contact with the N− drift layer 604 and bridges theadjacent P-well regions 606 (i.e. the adjacent unit cells) of the one ormore P-well regions 606. The work function of the first Schottky metalregion 613 is less than the work function of the second Schottky metalregion 628.

FIG. 6c illustrates an embodiment of a third quadrant current conductionthrough an intrinsic p-n junction diode region vs a Schottky dioderegion connected in parallel to DMOSFET. The third quadrant current ofthe body diode region is indicated as 630 in the FIG. 6 c. The thirdquadrant current of the anti-parallel Schottky diode region is indicatedas 632 in the FIG. 6 c. At a certain point, the third quadrant currentpassing through the body diode region intersects with the third quadrantcurrent passing through the Schottky diode region which is indicated as634 in FIG. 6 c. Above this point, the third quadrant current is bipolarin nature which results in performance and reliability issues.

FIG. 6d illustrates an embodiment of a third quadrant current conductionthrough the DMOSFET after connecting the one or more Schottky dioderegions in series with the one or more body diode regions of theDMOSFET. The third quadrant current of the body diode region isindicated as 636 in the FIG. 6 d. Due to the existence of the one ormore Schottky diode regions in series connection with the one or morebody diode regions, the magnitude of the third quadrant current isshifted by the additional current required for the one or more Schottkydiode regions to turn-on first. The shift in the magnitude of the thirdquadrant current ((i.e.) the increased third quadrant current), afterconnecting the one or more Schottky diode regions in series with the oneor more body diode regions, is indicated as 638 in FIG. 6 d. It isevident from FIG. 6c and FIG. 6 d, the magnitude of the third quadrantcurrent is increased when the one or more Schottky Diode regions isconnected in series with the one or more body diode regions of theDMOSFET.

FIGS. 7a-7x illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 6 a. The process of manufacturing theDMOSFET structure (shown in FIG. 7a ) comprises preparing a SiliconCarbide (SiC) substrate having a N+ substrate 702 and a N− drift layer704 as shown in FIG. 7 a. The N− drift layer 704 of the SiC substrate isepi-grown and prepared such that a doping concentration and a thicknessof the N− drift layer 704 are selected primarily based on blockingvoltage and forward conduction loss. The N+ substrate 702 is highlyconductive when compared to the N− drift layer 704 and the N+ substrate702 is in direct contact with the N− drift layer 704. A first patternedhard mask layer 705 is formed on top of the SiC substrate as shown inFIG. 7 b. The first patterned hard mask layer 705 is thick enough forcompletely blocking high energy impurities during implantation. In anembodiment, the first patterned hard mask layer 705 is a hard mask of atleast one of oxide, nitride and polysilicon.

A first p-type ion implantation is formed in FIG. 7c through the firstpatterned hard mask layer 705 to form a p-well region 706. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 705 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 7 d. A second patternedhard mask layer 707 is then formed on the top of the SiC substrate asshown in FIG. 7e for subsequent ion implantation. The second patternedhard mask layer 707 is a photoresist based material and thick enough forpreventing any unwanted high energy impurities particles penetrating thesecond patterned hard mask layer 707. A first n-type ion implantation isformed through the second patterned hard mask layer 707 to form a N+source region 708 within the p-well region 706 as shown in FIG. 7f In anembodiment, the first n-type ion implantation is performed with one ormore n-type impurities (e.g. nitrogen, phosphorous etc.). The secondpatterned hard mask layer 707 is then removed after the first n-type ionimplantation by at least one of dry etching and wet etching process asshown in FIG. 7 g.

A third patterned hard mask layer 709 is then formed on top of the SiCsubstrate as shown in FIG. 7 h. A second p-type implantation isperformed through the third patterned hard mask layer 709 to form a P+region 703 within the p-well region 706 as shown in FIG. 7 i.

The third patterned hard mask layer 709 is then removed as shown in FIG.7j by at least one of a dry etching and a wet etching process once theP+ region 703 is formed. The SiC substrate undergoes thermal activationannealing with a carbon-based protection coating at a predefinedtemperature. In an embodiment, the predefined temperature for performingthe thermal activation annealing is 1700-degree Celsius. The SiCsubstrate then may undergo an additional ion implantation for forming acurrent spreading layer to improve on-state resistance. Ionimplantations (e.g. the first p-type implantation, the first n-typeimpanation, the second p-type implantation, edge terminationimplantation, current spreading layer implantation etc.) undergone bythe SiC substrate is performed prior to the thermal activation annealingstep. The carbon-based protection coating is then removed from the SiCsubstrate. The SiC substrate then undergoes a sacrificial oxide growthand subsequently the sacrificial oxide removal. An active region of theSiC DMOSFET is then patterned by forming and patterning field oxidelayer on the SiC substrate.

A gate insulator 714 is then formed on top of the SiC substrate as shownin FIG. 7 k. The gate insulator is then patterned as shown in FIG. 7 l.A polysilicon layer 716 is then formed on top of the SiC substrate asshown in FIG. 7 m. The polysilicon layer 716 is then patterned as shownin FIG. 7 n. Contacts for the polysilicon layer is kept open for padmetal deposition for forming a gate pad region and one or more gate busregions. An interlayer dielectric (ILD) 718 is then formed on top of theSiC substrate as shown in FIG. 7 o. The interlayer dielectric (ILD) 718is then patterned for exposing the portions of the SiC substrate via theopenings of the ILD 718 as shown in FIG. 7 p. A first silicide layer 720is then formed on the exposed portions of top of the SiC substrate forforming a first Ohmic contact as shown in FIG. 7 q. In an embodiment,the first silicide layer 720 is a nickel-based silicide layer. Inanother embodiment, the nickel-based silicide is formed by Nickeldeposition on the top of the SiC substrate, thermal activation annealingof the deposited Nickel for silicide formation, and removal of anyun-reacted Nickel from the SiC substrate. A fourth patterned hard masklayer 711 is formed on top of the SiC substrate as shown in FIG. 7 r. AnILD etching is formed on the SiC substrate through the fourth patternedhard mask layer 711 to selectively remove the exposed portions of theILD layer 718 as shown in FIG. 7 s. A first metal is deposited on top ofthe SiC substrate through the fourth patterned hard mask layer 711 asshown in FIG. 7 t. The first metal is lifted off and annealed to form afirst metal region 713 (e.g. the first Schottky metal region 713) to bein direct contact with the P+ region 703 as shown in FIG. 7 u. The firstSchottky metal region 713 comprises a target work function. In anembodiment, the target work function may range from 3.5 electron voltsto 6 electron volts. The first Schottky metal region 713 is thenannealed with a predefined thermal budget for forming a first Schottkycontact region between the first Schottky metal region 713 and the topof each P+ region 703. In an embodiment, the predefined thermal budgetranges from 55° C. to 1100° C. The thermal budget for forming the firstSchottky contact region is precisely designed and controlled as itdirectly impacts electrical properties of the first Schottky contactregions. A first pad metal 724 is formed on top of the SiC substrate asshown in FIG. 7 v.

A second silicide layer 722 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 7 w. In anembodiment, the second silicide layer 722 is then formed on back of theSiC substrate for forming the second Ohmic contact (e.g. a drainterminal contact). In an embodiment, the second silicide layer 722 isthe nickel-based silicide layer. A second pad metal 726 is then formedon bottom of the second silicide layer 722 of the SiC substrate. In anembodiment, the second pad metal formation is performed by at least oneof e-beam and sputtering.

A fifth patterned hard mask layer 715 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fifth patterned hard mask layer 715 is formed forselectively removing the exposed portions of the ILD layer 718 anddepositing a second metal region 728 (i.e. a second Schottky metalregion 728) (shown in FIG. 5b ) on top of the SiC substrate. The fifthpatterned hard mask layer 715 is used for both etching the portion ofthe ILD layer 718 and lifting off the second Schottky metal region 728when second Schottky metal is deposited. The second Schottky metalregion 728 is in direct contact with the N− drift layer 704 and bridgetwo adjacent P-well regions 706 (i.e. bridges the adjacent unit cells).The second Schottky metal region 728 is then annealed with a predefinedthermal budget for forming a second Schottky metal contact between thesecond Schottky metal region 728 and the portion of the N− drift layer704 exposed at the top surface of the SiC substrate. In an embodiment,the predefined thermal budget ranges from 55° C. to 1100° C. In FIG. 6bthe first pad metal and the second pad metal formation are performedonce the second Schottky metal region 728 formation is completed.

FIGS. 8a-8c illustrate an embodiment of cross-sectional structures of aunit cell of a DMOSFET comprising a second conductivity type wellcontact region that meanders at three different locations respectively.The DMOSFET shown in FIGS. 8 a, 8 b and 8 c is a n-type planar gate SiCDMOSFET. In an embodiment, the DMOSFET is a p-type planar gate DMOSFET.In another embodiment, the DMOSFET is a n-type trench gate DMOSFET. Inyet another embodiment, the DMOSFET is a p-type trench gate DMOSFET. TheDMOSFET (shown in FIGS. 8 a, 8 b and 8 c) comprises a Silicon Carbide(SiC) substrate. The SiC substrate comprises a N+ substrate 802 and a N−drift layer 804. The DMOSFET also comprises a P-well region 806, a N+source region 808 and a P+ region 803 (i.e. the second conductivity typewell contact region). The N+ source region 808 (i.e. a firstconductivity type source region) is formed within the P-well region 806.The P+ region 803 is meandering within the P-well region 806 byperforming a p-type implantation at respective locations. The P+ region803 comprise a periodic spacing with the successive P+ region 803 (i.e.non-contiguous). Further the lateral extent of the P+ region 803 varieswith a non-zero value in a direction orthogonal to the unit cell. Themeandering P+ region 803 periodically forms ohmic contacts to a firstpad metal 824 (e.g. a source metal) via a first silicide layer 820between two interlayer dielectric (ILD) bumps 817 located between metaloxide semiconductor gate stack and the first pad metal 824. Themeandering P+ region 803 follows Zigzag path, where corners of thezigzag path is right angled. The Zigzag path of the meandering P+ region803 comprises dimensions α, β, and γ. The meandering P+ region 803comprise a target size and are a target spacing between adjacentjunction points located between the meandering P+ region 803. Contactresistance to the first pad metal 824 (e.g. the source metal) varieswhen the P+ region 803 under the ILD bumps 817 do not have directcontact with the first pad metal 824 and when the P+ region 803 havedirect contact with the first pad metal 824 through the first silicidelayer 820. The portions of the meandering P+ region 803 which aredirectly under the ILD bumps 817 functions as networks of distributedballast resistors and provides an additional source resistance to thesource contact resistance. The additional contact resistance provideddirectly impacts the differential on-resistance of one or more bodydiode regions of the DMOSFET. The impacted differential-on resistance ofthe body diode regions suppresses increase of forward conduction currentof the one or more body diode regions. The limited forward conductioncurrent mitigates basal plane dislocation (BPD). Since the sourcecontact resistance is dependent on the sizing, the spacing betweenadjacent junction points located between the meandering P+ region 803,and the silicide region between the adjacent ILD bumps 817, the sourcecontact resistance is tuned by sizing the P+ region 803 to a target sizeand controlling the spacing to a target spacing. In an embodiment, thetarget size ranges from 10 nm to 10 μm. In another embodiment, thetarget spacing ranges from 10 nm to 10 μm. Say for a first instance,when width (α) of the meandering P+ region 803 is reduced, theresistance of each ballast resistor network is increased which degradesthe differential on-resistance of the one or more body diode regions.The reduction of the width (α), also shrinks the area where the Ohmiccontacts are formed, degrades the differential on-resistance of the oneor more body diode regions. Say for a second instance, when the periodicspacing (γ) between the meandering P+ region 803 is increased, theresistance of each ballast resistor network is increased which degradesthe differential on-resistance of the one or more body diode regions.Say for a third instance, when spacing (β) between two adjacent junctionpoints between the meandering featured P+ region 803, and the straightsilicide region between two adjacent ILD bumps 817 is increased, theresistance of each ballast resistor network is increased which degradesthe differential on-resistance of the one or more body diode regions.

FIGS. 8d-8f illustrate an embodiment of cross-sectional structures ofone or more unit cells of a diode integrated DMOSFET, each DMOSFET unitcell comprising the second conductivity type well contact region thatmeanders at three different locations respectively. The DMOSFET (shownin FIGS. 8 d, 8 e & 8 f) is a n-type planar gate SiC DMOSFET. TheDMOSFET shown in FIGS. 8 d, 8 e & 8 f operates in a similar way to FIGS.8 a, 8 b & 8 c. In addition to FIGS. 8 a, 8 b & 8 c, the DMOSFET (shownin FIGS. 8 d, 8 e & 8 f) comprises a metal region (i.e. a Schottky metalregion 828) in direct contact with the N− drift layer 804 and bridgesadjacent P-well regions 806 of the one or more P-well regions 806 (i.e.bridges the adjacent unit cells). The DMOSFET comprises the P+ region803 that meanders within each P-well region 806.

FIGS. 9a-9t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 8 a. The process of manufacturing theDMOSFET structure (shown in FIG. 9a ) comprises preparing a SiliconCarbide (SiC) substrate having a N+ substrate 902 and a N− drift layer904 as shown in FIG. 9 a. The N− drift layer 904 of the SiC substrate isepi-grown and prepared such that a doping concentration and a thicknessof the N− drift layer 904 are selected primarily based on blockingvoltage and forward conduction loss. The N+ substrate 902 is highlyconductive when compared to the N− drift layer 904 and the N+ substrate902 is directly located under the N− drift layer 904. A first patternedhard mask layer 905 is formed on top of the SiC substrate as shown inFIG. 9 b. The first patterned hard mask layer 905 is thick enough forcompletely blocking high energy impurities during implantation. In anembodiment, the first patterned hard mask layer 905 is a hard mask of atleast one of oxide, nitride and a polysilicon layer.

A first p-type ion implantation is formed in FIG. 9c through the firstpatterned hard mask layer 905 to form a p-well region 906. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 905 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 9 d. A second patternedhard mask layer 907 is then formed on the top of the SiC substrate asshown in FIG. 9e for subsequent ion implantation. The second patternedhard mask layer 907 is a photoresist based material and thick enough forpreventing any unwanted high energy impurities particles penetrating thesecond patterned hard mask layer 907. A first n-type ion implantation isformed through the second patterned hard mask layer 907 to form a N+source region 908 within the p-well region 906 as shown in FIG. 9 f. Inan embodiment, the first n-type ion implantation is performed with oneor more n-type impurities (e.g. nitrogen, phosphorous etc.). The secondpatterned hard mask layer 907 is then removed after the first n-type ionimplantation by at least one of dry etching and wet etching process asshown in FIG. 9 g.

A third patterned hard mask layer 909 is then formed on top of the SiCsubstrate as shown in FIG. 9 h. A second p-type implantation isperformed through the third patterned hard mask layer 909 to form a P+region 903, at a first location within the p-well region 906 as shown inFIG. 9 i.

The third patterned hard mask layer 909 is then removed as shown in FIG.9j by at least one of a dry etching and a wet etching process once theP+ region 903 is formed. The SiC substrate undergoes thermal activationannealing with a carbon-based protection coating at a predefinedtemperature. In an embodiment, the predefined temperature for performingthe thermal activation annealing is 1700-degree Celsius. The SiCsubstrate then may undergo an additional ion implantation for forming acurrent spreading layer to improve on-state resistance. Ionimplantations (e.g. the first p-type implantation, the first n-typeimpanation, the second p-type implantation, edge terminationimplantation, current spreading layer implantation etc.) undergone bythe SiC substrate is performed prior to the thermal activation annealingstep. The carbon-based protection coating is then removed from the SiCsubstrate. The SiC substrate then undergoes a sacrificial oxide growthand subsequently the sacrificial oxide removal. An active region of theSiC DMOSFET is then patterned by forming and patterning field oxidelayer on the SiC substrate.

A gate insulator 914 is then formed on top of the SiC substrate as shownin FIG. 9 k. The gate insulator 914 is then patterned as shown in FIG. 9l. A polysilicon layer 916 is then formed on top of the SiC substrate asshown in FIG. 9 m. The polysilicon layer 916 is then patterned as shownin FIG. 9 n. Contacts for the polysilicon layer is kept open for padmetal deposition for forming a gate pad region and one or more gate busregions. An interlayer dielectric (ILD) 918 is then formed on top of theSiC substrate as shown in FIG. 9 o. The interlayer dielectric (ILD) 918is then patterned for exposing the portions of the SiC substrate via theopenings of the ILD 918 and leaving one or more ILD bumps 917 as shownin FIG. 9 p. A first silicide layer 920 is then formed between the oneor more ILD bumps 917 on the exposed portions of top of the SiCsubstrate for forming a first Ohmic contact as shown in FIG. 9 q. In anembodiment, the first silicide layer 920 is a nickel-based silicidelayer. In another embodiment, the nickel-based silicide is formed byNickel deposition on the top of the SiC substrate, thermal activationannealing of the deposited Nickel for silicide formation, and removal ofany un-reacted Nickel from the SiC substrate. A first pad metal 924 isformed on top of the SiC substrate as shown in FIG. 9 r. The P+ region903, formed at the first location, covers both portions of the firstsilicide layer 920 between the adjacent ILD bumps 917 and the portionsunder the ILD bumps 917.

A second silicide layer 922 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 9 s. In anembodiment, the second silicide layer 922 is then formed on back of theSiC substrate for forming the second Ohmic contact. In an embodiment,the second silicide layer 922 is also the nickel-based silicide layer. Asecond pad metal 926 is then formed on bottom of the second silicidelayer 922 of the SiC substrate as shown in FIG. 9 t. In an embodiment,the second pad metal formation is performed by at least one of e-beamand sputtering.

A fourth patterned hard mask layer 911 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 911 is formed forselectively removing the exposed portions of the ILD layer 918 anddepositing a metal region (i.e. a Schottky metal region 928) (shown inFIGS. 8 d, 8 e & 8 f) on top of the SiC substrate. The fourth patternedhard mask layer 911 is used for both etching the portion of the ILDlayer 918 and lifting off the Schottky metal region 928 when Schottkymetal is deposited. The Schottky metal region 928 is in direct contactwith the N− drift layer 904 and bridge two adjacent P-well regions 906(i.e. bridges the adjacent unit cells). The Schottky metal region 928 isthen annealed with a predefined thermal budget for forming a Schottkymetal contact between the Schottky metal region 928 and the portion ofthe N− drift layer 904 exposed at the top surface of the SiC substrate.In an embodiment, the predefined thermal budget ranges from 55° C. to1100° C. In FIGS. 8 d, 8 e & 8 f, the first pad metal and the second padmetal formation are performed once the Schottky metal region 928formation is completed.

FIGS. 10a-10t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 8 b. The process of manufacturing theDMOSFET structure (shown in FIG. 10a ) comprises preparing a siliconcarbide (SiC) substrate having a N+ substrate 1002 and a N− drift layer1004 as shown in FIG. 10 a. The N− drift layer 1004 of the SiC substrateis epi-grown and prepared such that a doping concentration and athickness of the N− drift layer 1004 are selected primarily based onblocking voltage and forward conduction loss. The N+ substrate 1002 ishighly conductive when compared to the N− drift layer 1004 and the N+substrate 1002 is in direct contact with the N− drift layer 1004. Afirst patterned hard mask layer 1005 is formed on top of the SiCsubstrate as shown in FIG. 10 b. The first patterned hard mask layer1005 is thick enough for completely blocking high energy impuritiesduring implantation. In an embodiment, the first patterned hard masklayer 1005 is a hard mask of at least one of oxide, nitride and apolysilicon layer.

A first p-type ion implantation is formed in FIG. 10c through the firstpatterned hard mask layer 1005 to form a p-well region 1006. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 1005 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 10 d. A secondpatterned hard mask layer 1007 is then formed on the top of the SiCsubstrate as shown in FIG. 10e for subsequent ion implantation. Thesecond patterned hard mask layer 1007 is a photoresist based materialand thick enough for preventing any unwanted high energy impuritiesparticles penetrating the second patterned hard mask layer 1007. A firstn-type ion implantation is formed through the second patterned hard masklayer 1007 to form a N+ source region 1008 within the p-well region 1006as shown in FIG. 10 f. In an embodiment, the first n-type ionimplantation is performed with one or more n-type impurities (e.g.nitrogen, phosphorous etc.). The second patterned hard mask layer 1007is then removed after the first n-type ion implantation by at least oneof dry etching and wet etching process as shown in FIG. 10 g.

A third patterned hard mask layer 1009 is then formed on top of the SiCsubstrate as shown in FIG. 10 h. A second p-type implantation isperformed through the third patterned hard mask layer 1009 to form a P+region 1003, at a second location, within the p-well region 1006 asshown in FIG. 10 i.

The third patterned hard mask layer 1009 is then removed as shown inFIG. 10j by at least one of a dry etching and a wet etching process oncethe P+ region 1003 is formed at the second location. The SiC substrateundergoes thermal activation annealing with a carbon-based protectioncoating at a predefined temperature. In an embodiment, the predefinedtemperature for performing the thermal activation annealing is1700-degree Celsius. The SiC substrate then may undergo an additionalion implantation for forming a current spreading layer to improveon-state resistance. Ion implantations (e.g. the first p-typeimplantation, the first n-type impanation, the second p-typeimplantation, edge termination implantation, current spreading layerimplantation etc.) undergone by the SiC substrate is performed prior tothe thermal activation annealing step. The carbon-based protectioncoating is then removed from the SiC substrate. The SiC substrate thenundergoes a sacrificial oxide growth and subsequently the sacrificialoxide removal. An active region of the SiC DMOSFET is then patterned byforming and patterning field oxide layer on the SiC substrate.

A gate insulator 1014 is then formed on top of the SiC substrate asshown in FIG. 10 k. The gate insulator 1014 is then patterned as shownin FIG. 10 l. A polysilicon layer 1016 is then formed on top of the SiCsubstrate as shown in FIG. 10 m. The polysilicon layer 1016 is thenpatterned as shown in FIG. 10 n. Contacts for the polysilicon layer iskept open for pad metal deposition for forming a gate pad region and oneor more gate bus regions. An interlayer dielectric (ILD) 1018 is thenformed on top of the SiC substrate as shown in FIG. 10 o. The interlayerdielectric (ILD) 1018 is then patterned for exposing the portions of theSiC substrate via the openings of the ILD 1018 and leaving one or moreILD bumps 1017 on top of the SiC substrate as shown in FIG. 10 p. Afirst silicide layer 1020 is then formed between the one or more ILDbumps 1017 on the exposed portions of top of the SiC substrate forforming a first Ohmic contact as shown in FIG. 10 q. In an embodiment,the first silicide layer 1020 is a nickel-based silicide layer. Inanother embodiment, the nickel-based silicide is formed by Nickeldeposition on the top of the SiC substrate, thermal activation annealingof the deposited Nickel for silicide formation, and removal of anyun-reacted Nickel from the SiC substrate. A first pad metal 1024 isformed on top of the SiC substrate as shown in FIG. 10 r. The P+ region1003, formed at the second location, is under the one or more ILD bumps1017 and do not form any direct contact with the first silicide layer1020.

A second silicide layer 1022 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 10 s. Inan embodiment, the second silicide layer 1022 is then formed on back ofthe SiC substrate for forming the second Ohmic contact. In anembodiment, the second silicide layer 1022 is also the nickel-basedsilicide layer. A second pad metal 1026 is then formed on bottom of thesecond silicide layer 1022 of the SiC substrate as shown in FIG. 10 t.In an embodiment, the second pad metal formation is performed by atleast one of e-beam and sputtering.

A fourth patterned hard mask layer 1011 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 1011 is formed forselectively removing the exposed portions of the ILD layer 1018 anddepositing a metal region 1028 (e.g. a Schottky metal region 1028)(shown in FIGS. 8 d, 8 e & 8 f) on top of the SiC substrate. The fourthpatterned hard mask layer 1011 is used for both etching the portion ofthe ILD layer 1018 and lifting off the Schottky metal region 1028 whenSchottky metal is deposited. The Schottky metal region 1028 is in directcontact with the N− drift layer 1004 and bridge two adjacent P-wellregions 1006 (i.e. bridges the adjacent unit cells). The Schottky metalregion 1028 is then annealed with a predefined thermal budget forforming a Schottky metal contact between the Schottky metal region 1028and the portion of the N− drift layer 1004 exposed at the top surface ofthe SiC substrate. In an embodiment, the predefined thermal budgetranges from 55° C. to 1100° C. In FIGS. 8 d, 8 e & 8 f, the first padmetal and the second pad metal formation are performed once the Schottkymetal region 1028 formation is completed.

FIG. 11a-11t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 8 c. The process of manufacturing theDMOSFET structure (shown in FIG. 11a ) comprises preparing a siliconcarbide (SiC) substrate having a N+ substrate 1102 and a N− drift layer1104 as shown in FIG. 11 a. The N− drift layer 1104 of the SiC substrateis epi-grown and prepared such that a doping concentration and athickness of the N− drift layer 1104 are selected primarily based onblocking voltage and forward conduction loss. The N+ substrate 1102 ishighly conductive when compared to the N− drift layer 1104 and the N+substrate 1102 is in direct contact with the N− drift layer 1104. Afirst patterned hard mask layer 1105 is formed on top of the SiCsubstrate as shown in FIG. 11 b. The first patterned hard mask layer1105 is thick enough for completely blocking high energy impuritiesduring implantation. In an embodiment, the first patterned hard masklayer 1105 is a hard mask of at least one of oxide, nitride and apolysilicon layer.

A first p-type ion implantation is formed in FIG. 11c through the firstpatterned hard mask layer 1105 to form a p-well region 1106. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 1105 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 11 d. A secondpatterned hard mask layer 1107 is then formed on the top of the SiCsubstrate as shown in FIG. 11e for subsequent ion implantation. Thesecond patterned hard mask layer 1107 is a photoresist based materialand thick enough for preventing any unwanted high energy impuritiesparticles penetrating the second patterned hard mask layer 1107. A firstn-type ion implantation is formed through the second patterned hard masklayer 1107 to form a first N+ source region 1108 within the p-wellregion 1106 as shown in FIG. 11 f. In an embodiment, the first n-typeion implantation is performed with one or more n-type impurities (e.g.nitrogen, phosphorous etc.). The second patterned hard mask layer 1107is then removed after the first n-type ion implantation by at least oneof dry etching and wet etching process as shown in FIG. 11 g.

A third patterned hard mask layer 1109 is then formed on top of the SiCsubstrate as shown in FIG. 11 h. A second p-type implantation isperformed through the third patterned hard mask layer 1109 to form a P+region 1103, at a third location, within the p-well region 1106 as shownin FIG. 11 i.

The third patterned hard mask layer 1109 is then removed as shown inFIG. 11j by at least one of a dry etching and a wet etching process oncethe P+ region 1103 is formed at the second location. The SiC substrateundergoes thermal activation annealing with a carbon-based protectioncoating at a predefined temperature. In an embodiment, the predefinedtemperature for performing the thermal activation annealing is1700-degree Celsius. The SiC substrate then may undergo an additionalion implantation for forming a current spreading layer to improveon-state resistance. Ion implantations (e.g. the first p-typeimplantation, the first n-type impanation, the second p-typeimplantation, edge termination implantation, current spreading layerimplantation etc.) undergone by the SiC substrate is performed prior tothe thermal activation annealing step. The carbon-based protectioncoating is then removed from the SiC substrate. The SiC substrate thenundergoes a sacrificial oxide growth and subsequently the sacrificialoxide removal. An active region of the SiC DMOSFET is then patterned byforming and patterning field oxide layer on the SiC substrate.

A gate insulator 1114 is then formed on top of the SiC substrate asshown in FIG. 11 k. The gate insulator 1114 is then patterned as shownin FIG. 11 l. A polysilicon layer 1116 is then formed on top of the SiCsubstrate as shown in FIG. 11 m. The polysilicon layer 1116 is thenpatterned as shown in FIG. 11 n. Contacts for the polysilicon layer iskept open for pad metal deposition for forming a gate pad region and oneor more gate bus regions. An interlayer dielectric (ILD) 1118 is thenformed on top of the SiC substrate as shown in FIG. 11 o. The interlayerdielectric (ILD) 1118 is then patterned for exposing the portions of theSiC substrate via the openings of the ILD 1118 and leaving one or moreILD bumps 1117 on top of the SiC substrate as shown in FIG. 11 p. Afirst silicide layer 1120 is then formed between the one or more ILDbumps 1117 on the exposed portions of top of the SiC substrate forforming one or more first Ohmic contacts as shown in FIG. 11 q. In anembodiment, the first silicide layer 1120 is a nickel-based silicidelayer. In another embodiment, the nickel-based silicide is formed byNickel deposition on the top of the SiC substrate, thermal activationannealing of the deposited Nickel for silicide formation, and removal ofany un-reacted Nickel from the SiC substrate. A first pad metal 1124 isformed on top of the SiC substrate as shown in FIG. 11 r. The P+ region1103, formed at the third location, is under the one or more ILD bumps1117 and do not form any direct contact with the first silicide layer1120.

A second silicide layer 1122 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 11 s. Inan embodiment, the second silicide layer 1122 is then formed on back ofthe SiC substrate for forming the second Ohmic contact. In anembodiment, the second silicide layer 1122 is also the nickel-basedsilicide layer. A second pad metal 1126 is then formed on bottom of thesecond silicide layer 1122 of the SiC substrate. In an embodiment, thesecond pad metal formation is performed by at least one of e-beam andsputtering.

A fourth patterned hard mask layer 1111 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 1111 is formed forselectively removing the exposed portions of the ILD layer 1118 anddepositing a metal region 1128 (i.e. a Schottky metal region 1128) shownin FIGS. 8 d, 8 e & 8 f on top of the SiC substrate. The fourthpatterned hard mask layer 1111 is used for both etching the portion ofthe ILD layer 1118 and lifting off the Schottky metal region 1128 whenSchottky metal is deposited. The Schottky metal region 1128 is in directcontact with the top of the N− drift layer 1104 and bridge two adjacentP-well regions 1106 (i.e. bridges the adjacent unit cells). The Schottkymetal region 1128 is then annealed with a predefined thermal budget forforming a Schottky metal contact between the Schottky metal region 1128and the portion of the N− drift layer 1104 exposed at the top surface ofthe SiC substrate. In an embodiment, the predefined thermal budgetranges from 55° C. to 1100° C. In FIGS. 8 d, 8 e & 8 f, the first padmetal and the second pad metal formation are performed once the Schottkymetal region 1128 formation is completed.

FIGS. 12a-12c illustrate an embodiment of cross sectional structures ofa unit cell of a double-implantation metal oxide semiconductor fieldeffect transistor (DMOSFET) comprising a second conductivity type wellcontact region that meanders at three different locations respectively,allowing a second conductivity type well region to be in contact with asource metal only through the second conductivity type well contactregion. The DMOSFET shown in FIGS. 12 a, 12 b and 12 c is a n-typeplanar gate SiC DMOSFET. In an embodiment, the DMOSFET is a p-typeplanar gate DMOSFET. The DMOSFET (shown in FIGS. 12 a, 12 b and 12 c)comprises a Silicon Carbide (SiC) substrate. The SiC substrate comprisesa N+ substrate 1202 and a N− drift layer 1204. The DMOSFET alsocomprises a P-well region 1206, a N+ source region 1208 and a P+ region1203 (i.e. the second conductivity type well contact region). The N+source regions 1208 is formed within the P-well region 1206. The P+region 1203 is meandering within the P-well region 1206 by performing ap-type implantation. The P+ region 1203 comprise a periodic spacing withthe successive P+ region 1203 (i.e. non-contiguous). Further the lateralextent of the P+ region 1203 varies with a non-zero value in a directionorthogonal to the unit cell. The meandering P+ region 1203 periodicallyforms ohmic contacts to a first pad metal 1224 (e.g. the source metal)via a first silicide layer 1220 between two interlayer dielectric (ILD)bumps 1217 located between metal oxide semiconductor gate stack and thefirst pad metal 1224. The P-well region 1206 contacts with the first padmetal 1224 (e.g. the source metal) only through the meandering P+ region1203. The P-well region 1206 do not have a direct contact with the firstpad metal 1224. The meandering P+ region 1203 follows Zigzag path, wherecorners of the zigzag path is right angled. The Zigzag path of themeandering P+ region 1203 comprises dimensions α, β, and γ. Themeandering P+ region 1203 comprise a target size and a target spacingbetween adjacent junction points located between the meandering P+region 803. Contact resistance to the first pad metal 1224 (e.g. thesource metal) varies when the P+ region 1203 under the ILD bumps 1217 donot have direct contact with the first pad metal 1224 and when the P+region 1203 have direct contact with the first pad metal 1224 throughthe first silicide layer 1220. The portions of the meandering P+ region1203 which are directly under the ILD bumps 1217 functions as networksof distributed ballast resistors and provides an additional sourceresistance to the source contact resistance. The additional contactresistance provided directly impacts the differential on-resistance ofone or more body diode regions of the DMOSFET. Since, the p-well region1206 contacts the first pad metal 1224 only through the meandering P+region 1203, flow of carriers is confined within the meandering P+region 1203. The confined flow of carriers increases source contactresistance of each ballast resistor network and further impactsdifferential on-resistance of the one or more body diode regions of theDMOSFET. Since the source contact resistance is dependent on the sizing,the spacing between adjacent junction points located between themeandering P+ region 1203, and the silicide region between the adjacentILD bumps 1217, the source contact resistance is tuned by sizing the P+region 1203 to a target size and controlling the spacing to a targetspacing. In an embodiment, the target size ranges from 10 nm to 10 μm.In another embodiment, the target spacing ranges from 10 nm to 10 μm.Say for a first instance, when width (α) of the meandering P+ region isreduced, the resistance of each ballast resistor network is increasedwhich degrades the differential on-resistance of the body diode regions.The reduction of the width (α) also shrinks the area where the Ohmiccontacts are formed so degrades the differential on-resistance of thebody diode regions. Say for a second instance, when spacing (γ) betweenthe meandering P+ region is increased, the resistance of each ballastresistor network is increased which degrades the differentialon-resistance of the body diode regions. Say for a third instance, whenspacing (β) between two adjacent junction points between the meanderingfeatured P+ region 1203, and the straight silicide region between twoadjacent ILD bumps 1217 is increased, the resistance of each ballastresistor network is increased which degrades the differentialon-resistance of the one or more body diode regions.

FIGS. 12d-12f illustrate an embodiment of cross sectional structures ofone or more unit cells of a diode integrated DMOSFET, each DMOSFET unitcell comprising the second conductivity type well contact region thatmeanders at three different locations respectively, allowing the secondconductivity type well region to be in contact with the source metalonly through the second conductivity type well contact region. TheDMOSFET (shown in FIGS. 12 d, 12 e & 12 f) is a n-type planar gate SiCDMOSFET. The DMOSFET shown in FIGS. 12 d, 12 e & 12 f operates in asimilar way to FIGS. 12 a, 12 b & 12 c. In addition to FIGS. 12 a, 12 b& 12 c, the DMOSFET (shown in FIGS. 12 d, 12 e & 12 f) comprises a metalregion 1228 (e.g. a Schottky metal region 1228) in direct contact withthe N− drift layer 1204 and bridges adjacent P-well regions 1206 of theone or more P-well regions 1206 (i.e. bridges the adjacent unit cells).

FIG. 12g illustrate an embodiment of a cross sectional structure of oneor more unit cells of a diode integrated trench gate MOSFET, comprisingone or more unit cells of an integrated Schottky diode, each MOSFET unitcell comprising the second conductivity type well contact region at thefirst location, allowing the second conductivity type well region to bein contact with the source metal only through the second conductivitytype well contact region. The trench gate MOSFET shown in FIG. 12g is an-type trench gate SiC MOSFET. In an embodiment, the trench gate MOSFETis a p-type trench gate SiC MOSFET. The trench gate MOSFET shown in FIG.12g operates in a similar way to planar gate MOSFET shown in FIG. 12aand FIG. 12 d. The main difference between the trench gate MOSFET andthe planar gate DMOSFET is that the trench gate MOSFET comprises one ormore trench gate structures instead of one or more planar gatestructures. The one or more trench gate structures of the trench gateMOSFET comprises sidewalls that are exposing to the first N+ sourceregion 1208 and the one or more P-well regions 1206. The bottom of theone or more trench gate structures is in vicinity of the bottom of theone or more P-well regions 1206. In an embodiment, the bottom of the oneor more trench gate structures is adjusted appropriately depending onelectrical properties of the MOSFET device. Each trench gate structureof the trench gate MOSFET comprises a gate insulator as liner along thesidewall and the bottom of the respective trench gate structure. Thetrench gate MOSFET also comprises the polysilicon layer that fills eachgate-insulator lined trenches and serves as gate electrode. The trenchgate MOSFET further comprises the interlayer dielectric (ILD) 1218 overeach polysilicon layer to open short circuitry between the first padmetal 1224 (e.g. the source metal) and the gate electrode.

FIGS. 13a-13t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 12 a. The process of manufacturing theDMOSFET structure (shown in FIG. 13a ) comprises preparing a siliconcarbide (SiC) substrate having a N+ substrate 1302 and a N− drift layer1304 as shown in FIG. 13 a. The N− drift layer 1304 of the SiC substrateis epi-grown and prepared such that a doping concentration and athickness of the N− drift layer 1304 are selected primarily based onblocking voltage and forward conduction loss. The N+ substrate 1302 ishighly conductive when compared to the N− drift layer 1304 and the N+substrate 1302 is directly located under the N− drift layer 1304. Afirst patterned hard mask layer 1305 is formed on top of the SiCsubstrate as shown in FIG. 13 b. The first patterned hard mask layer1305 is thick enough for completely blocking high energy impuritiesduring implantation. In an embodiment, the first patterned hard masklayer 1305 is a hard mask of at least one of oxide, nitride and apolysilicon layer.

A first p-type ion implantation is formed in FIG. 13c through the firstpatterned hard mask layer 1305 to form a p-well region 1306. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 1305 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 13 d. A secondpatterned hard mask layer 1307 is then formed on the top of the SiCsubstrate as shown in FIG. 13e for subsequent ion implantation. Thesecond patterned hard mask layer 1307 is a photoresist based materialand thick enough for preventing any unwanted high energy impuritiesparticles penetrating the second patterned hard mask layer 1307. A firstn-type ion implantation is formed through the second patterned hard masklayer 1307 to form a N+ source region 1308 within the p-well region 1306as shown in FIG. 13 f. In an embodiment, the first n-type ionimplantation is performed with one or more n-type impurities (e.g.nitrogen, phosphorous etc.). The second patterned hard mask layer 1307is then removed after the first n-type ion implantation by at least oneof dry etching and wet etching process as shown in FIG. 13 g.

A third patterned hard mask layer 1309 is then formed on top of the SiCsubstrate as shown in FIG. 13 h. A second p-type implantation isperformed through the third patterned hard mask layer 1309 to form a P+region 1303, at a first location, within the p-well region 1306 as shownin FIG. 13 i. The P+ region 1303 formed at the first location allows theP-well region 1306 to be in contact with a first pad metal 1324 (e.g. asource metal) only through the P+ region 1303 formed at the firstlocation.

The third patterned hard mask layer 1309 is then removed as shown inFIG. 13j by at least one of a dry etching and a wet etching process oncethe P+ region 1303 is formed. The SiC substrate undergoes thermalactivation annealing with a carbon-based protection coating at apredefined temperature. In an embodiment, the predefined temperature forperforming the thermal activation annealing is 1700-degree Celsius. TheSiC substrate then may undergo an additional ion implantation forforming a current spreading layer to improve on-state resistance. Ionimplantations (e.g. the first p-type implantation, the first n-typeimpanation, the second p-type implantation, edge terminationimplantation, current spreading layer implantation etc.) undergone bythe SiC substrate is performed prior to the thermal activation annealingstep. The carbon-based protection coating is then removed from the SiCsubstrate. The SiC substrate then undergoes a sacrificial oxide growthand subsequently the sacrificial oxide removal. An active region of theSiC DMOSFET is then patterned by forming and patterning field oxidelayer on the SiC substrate.

A gate insulator 1314 is then formed on top of the SiC substrate asshown in FIG. 13 k. The gate insulator 1314 is then patterned as shownin FIG. 13 l. A polysilicon layer 1316 is then formed on top of the SiCsubstrate as shown in FIG. 13 m. The polysilicon layer 1316 is thenpatterned as shown in FIG. 13 n. Contacts for the polysilicon layer 1316is kept open for pad metal deposition for forming a gate pad region andone or more gate bus regions. An interlayer dielectric (ILD) 1318 isthen formed on top of the SiC substrate as shown in FIG. 13 o. Theinterlayer dielectric (ILD) 1318 is then patterned for exposing theportions of the SiC substrate via the openings of the ILD 1318 andleaving one or more ILD bumps 1317 as shown in FIG. 13 p. A firstsilicide layer 1320 is then formed between the one or more ILD bumps1317 on the exposed portions of top of the SiC substrate for forming afirst Ohmic contact as shown in FIG. 13 q. In an embodiment, the firstsilicide layer 1320 is a nickel-based silicide layer. In anotherembodiment, the nickel-based silicide is formed by Nickel deposition onthe top of the SiC substrate, thermal activation annealing of thedeposited Nickel for silicide formation, and removal of any un-reactedNickel from the SiC substrate. The first pad metal 1324 is formed on topof the SiC substrate as shown in FIG. 13 r. The P+ region 1303, formedat the first location, covers both portions of the first silicide layer1320 between the adjacent ILD bumps 1317 and the portions under the ILDbumps 1317. The p-well region 1306 contacts with the first pad metal1324 only through the P+ region 1303 formed at the first location.

A second silicide layer 1322 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 13 s. Inan embodiment, the second silicide layer 1322 is then formed on back ofthe SiC substrate for forming the second Ohmic contact. In anembodiment, the second silicide layer 1322 is also the nickel-basedsilicide layer. A second pad metal 1326 is then formed on bottom of thesecond silicide layer 1322 of the SiC substrate as shown in FIG. 13 t.In an embodiment, the second pad metal formation is performed by atleast one of e-beam and sputtering.

A fourth patterned hard mask layer 1311 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 1311 is formed forselectively removing the exposed portions of the ILD layer 1318 anddepositing a metal region (e.g. the Schottky metal region 1328) shown inFIGS. 13 d, 13 e & 13 f on top of the SiC substrate. The fourthpatterned hard mask layer 1311 is used for both etching the portion ofthe ILD layer 1318 and lifting off the Schottky metal region 1328 whenSchottky metal is deposited. The Schottky metal region 1328 is in directcontact with the top of the N− drift layer 1304 and bridge two adjacentP-well regions 1306 (i.e. bridges the adjacent unit cells). The Schottkymetal region 1328 is then annealed with a predefined thermal budget forforming a Schottky metal contact between the Schottky metal region 1328and the portion of the N− drift layer 1304 exposed at the top surface ofthe SiC substrate. In an embodiment, the predefined thermal budgetranges from 55° C. to 1100° C. In FIGS. 12 d, 12 e & 12 f, the first padmetal and the second pad metal formation are performed once the Schottkymetal region 1328 formation is completed.

FIGS. 14a-14t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 12 b. The process of manufacturing theDMOSFET structure (shown in FIG. 14a ) comprises preparing a siliconcarbide (SiC) substrate having a N+ substrate 1402 and a N− drift layer1404 as shown in FIG. 14 a. The N− drift layer 1404 of the SiC substrateis epi-grown and prepared such that a doping concentration and athickness of the N− drift layer 1404 are selected primarily based onblocking voltage and forward conduction loss. The N+ substrate 1402 ishighly conductive when compared to the N− drift layer 1404 and the N+substrate 1402 is directly located under the N− drift layer 1404. Afirst patterned hard mask layer 1405 is formed on top of the SiCsubstrate as shown in FIG. 14 b. The first patterned hard mask layer1405 is thick enough for completely blocking high energy impuritiesduring implantation. In an embodiment, the first patterned hard masklayer 1405 is a hard mask of at least one of oxide, nitride and apolysilicon layer.

A first p-type ion implantation is formed in FIG. 14c through the firstpatterned hard mask layer 1405 to form a p-well region 1406. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 1405 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 14 d. A secondpatterned hard mask layer 1407 is then formed on the top of the SiCsubstrate as shown in FIG. 14e for subsequent ion implantation. Thesecond patterned hard mask layer 1407 is a photoresist based materialand thick enough for preventing any unwanted high energy impuritiesparticles penetrating the second patterned hard mask layer 1407. A firstn-type ion implantation is formed through the second patterned hard masklayer 1407 to form a N+ source region 1408 within the p-well region 1406as shown in FIG. 14 f. In an embodiment, the first n-type ionimplantation is performed with one or more n-type impurities (e.g.nitrogen, phosphorous etc.). The second patterned hard mask layer 1407is then removed after the first n-type ion implantation by at least oneof dry etching and wet etching process as shown in FIG. 14 g.

A third patterned hard mask layer 1409 is then formed on top of the SiCsubstrate as shown in FIG. 14 h. A second p-type implantation isperformed through the third patterned hard mask layer 1409 to form a P+region 1403, at a second location, within the p-well region 1406 asshown in FIG. 14 i.

The third patterned hard mask layer 1409 is then removed as shown inFIG. 14j by at least one of a dry etching and a wet etching process oncethe P+ region 1403 is formed at the second location. The SiC substrateundergoes thermal activation annealing with a carbon-based protectioncoating at a predefined temperature. In an embodiment, the predefinedtemperature for performing the thermal activation annealing is1700-degree Celsius. The SiC substrate then may undergo an additionalion implantation for forming a current spreading layer to improveon-state resistance. Ion implantations (e.g. the first p-typeimplantation, the first n-type impanation, the second p-typeimplantation, edge termination implantation, current spreading layerimplantation etc.) undergone by the SiC substrate is performed prior tothe thermal activation annealing step. The carbon-based protectioncoating is then removed from the SiC substrate. The SiC substrate thenundergoes a sacrificial oxide growth and subsequently the sacrificialoxide removal. An active region of the SiC DMOSFET is then patterned byforming and patterning field oxide layer on the SiC substrate.

A gate insulator 1414 is then formed on top of the SiC substrate asshown in FIG. 14 k. The gate insulator 1414 is then patterned as shownin FIG. 14 l. A polysilicon layer 1416 is then formed on top of the SiCsubstrate as shown in FIG. 14 m. The polysilicon layer 1416 is thenpatterned as shown in FIG. 14 n. Contacts for the polysilicon layer iskept open for pad metal deposition for forming a gate pad region and oneor more gate bus regions. An interlayer dielectric (ILD) 1418 is thenformed on top of the SiC substrate as shown in FIG. 14 o. The interlayerdielectric (ILD) 1418 is then patterned for exposing the portions of theSiC substrate via the openings of the ILD 1418 and leaving one or moreILD bumps 1417 on top of the SiC substrate as shown in FIG. 14 p. Afirst silicide layer 1420 is then formed between the one or more ILDbumps 1417 on the exposed portions of top of the SiC substrate forforming a first Ohmic contacts as shown in FIG. 14 q. In an embodiment,the first silicide layer 1420 is a nickel-based silicide layer. Inanother embodiment, the nickel-based silicide is formed by Nickeldeposition on the top of the SiC substrate, thermal activation annealingof the deposited Nickel for silicide formation, and removal of anyun-reacted Nickel from the SiC substrate. A first pad metal 1424 isformed on top of the SiC substrate as shown in FIG. 14 r. The P+ region1403, formed at the second location, is under the one or more ILD bumps1417 and do not form any direct contact with the first silicide layer1420.

A second silicide layer 1422 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 14 s. Inan embodiment, the second silicide layer 1422 is then formed on back ofthe SiC substrate for forming the second Ohmic contact. In anembodiment, the second silicide layer 1422 is also the nickel-basedsilicide layer. A second pad metal is then formed on bottom of thesecond silicide layer 1422 of the SiC substrate as shown in FIG. 14 t.In an embodiment, the second pad metal formation is performed by atleast one of e-beam and sputtering.

A fourth patterned hard mask layer 1411 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 1411 is formed forselectively removing the exposed portions of the ILD layer 1418 anddepositing a metal region (i.e. a Schottky metal region 1428) shown inFIGS. 12 d, 12 e & 12 f on top of the SiC substrate. The fourthpatterned hard mask layer 1411 is used for both etching the portion ofthe ILD layer 1418 and lifting off the Schottky metal region 1428 whenSchottky metal is deposited. The Schottky metal region 1428 is in directcontact with the N− drift layer 1404 and bridge two adjacent P-wellregions 1406 (i.e. bridges the adjacent unit cells). The Schottky metalregion 1428 is then annealed with a predefined thermal budget forforming a Schottky metal contact between the Schottky metal region 1428and the portion of the N− drift layer 1404 exposed at the top surface ofthe SiC substrate. In an embodiment, the predefined thermal budgetranges from 55° C. to 1100° C. In FIGS. 12 d, 12 e & 12 f, the first padmetal and the second pad metal formation are performed once the Schottkymetal region 1428 formation is completed.

FIGS. 15a-15t illustrate an embodiment of a process of manufacturing theDMOSFET structure shown in FIG. 12 c. The process of manufacturing theDMOSFET structure (shown in FIG. 15a ) comprises preparing a siliconcarbide (SiC) substrate having a N+ substrate 1502 and a N− drift layer1504 as shown in FIG. 15 a. The N− drift layer 1504 of the SiC substrateis epi-grown and prepared such that a doping concentration and athickness of the N− drift layer 1504 are selected primarily based onblocking voltage and forward conduction loss. The N+ substrate 1502 ishighly conductive when compared to the N− drift layer 1504 and the N+substrate 1502 is directly located under the N− drift layer 1504. Afirst patterned hard mask layer 1505 is formed on top of the SiCsubstrate as shown in FIG. 15 b. The first patterned hard mask layer1505 is thick enough for completely blocking high energy impuritiesduring implantation. In an embodiment, the first patterned hard masklayer 1505 is a hard mask of at least one of oxide, nitride and apolysilicon layer.

A first p-type ion implantation is formed in FIG. 15c through the firstpatterned hard mask layer 1505 to form a p-well region 1506. In anembodiment, the first p-type ion implantation is performed with one ormore p-type impurities (e.g. aluminum, boron, etc.). In anotherembodiment, first p-type ion implantation may comprise a screen oxidelayer. The first patterned hard mask layer 1505 is then removed, afterthe first p-type ion implantation, by at least one of dry etchingprocess and wet etching process as shown in FIG. 15 d. A secondpatterned hard mask layer 1507 is then formed on the top of the SiCsubstrate as shown in FIG. 15e for subsequent ion implantation. Thesecond patterned hard mask layer 1507 is a photoresist based materialand thick enough for preventing any unwanted high energy impuritiesparticles penetrating the second patterned hard mask layer 1507. A firstn-type ion implantation is formed through the second patterned hard masklayer 1507 to form a N+ source region 1508 within the p-well region 1506as shown in FIG. 15 f. In an embodiment, the first n-type ionimplantation is performed with one or more n-type impurities (e.g.nitrogen, phosphorous etc.). The second patterned hard mask layer 1507is then removed after the first n-type ion implantation by at least oneof dry etching and wet etching process as shown in FIG. 15 g.

A third patterned hard mask layer 1509 is then formed on top of the SiCsubstrate as shown in FIG. 15 h. A second p-type implantation isperformed through the third patterned hard mask layer 1509 to form a P+region 1503, at a third location, within the p-well region 1506 as shownin FIG. 15 i.

The third patterned hard mask layer 1509 is then removed as shown inFIG. 15j by at least one of a dry etching and a wet etching process oncethe P+ region 1503 is formed at the second location. The SiC substrateundergoes thermal activation annealing with a carbon-based protectioncoating at a predefined temperature. In an embodiment, the predefinedtemperature for performing the thermal activation annealing is1700-degree Celsius. The SiC substrate then may undergo an additionalion implantation for forming a current spreading layer to improveon-state resistance. Ion implantations (e.g. the first p-typeimplantation, the first n-type impanation, the second p-typeimplantation, edge termination implantation, current spreading layerimplantation etc.) undergone by the SiC substrate is performed prior tothe thermal activation annealing step. The carbon-based protectioncoating is then removed from the SiC substrate. The SiC substrate thenundergoes a sacrificial oxide growth and subsequently the sacrificialoxide removal. An active region of the SiC DMOSFET is then patterned byforming and patterning field oxide layer on the SiC substrate.

A gate insulator 1514 is then formed on top of the SiC substrate asshown in FIG. 15 k. The gate insulator 1514 is then patterned as shownin FIG. 15 l. A polysilicon layer 1516 is then formed on top of the SiCsubstrate as shown in FIG. 15 m. The polysilicon layer 1516 is thenpatterned as shown in FIG. 15 n. Contacts for the polysilicon layer iskept open for pad metal deposition for forming a gate pad region and oneor more gate bus regions. An interlayer dielectric (ILD) 1518 is thenformed on top of the SiC substrate as shown in FIG. 15 o. The interlayerdielectric (ILD) 1518 is then patterned for exposing the portions of theSiC substrate via the openings of the ILD 1518 and leaving one or moreILD bumps 1517 on top of the SiC substrate as shown in FIG. 15 p. Afirst silicide layer 1520 is then formed between the one or more ILDbumps 1517 on the exposed portions on top of the SiC substrate forforming a first Ohmic contact as shown in FIG. 15 q. In an embodiment,the first silicide layer 1520 is a nickel-based silicide layer. Inanother embodiment, the nickel-based silicide is formed by Nickeldeposition on the top of the SiC substrate, thermal activation annealingof the deposited Nickel for silicide formation, and removal of anyun-reacted Nickel from the SiC substrate. A first pad metal 1524 isformed on top of the SiC substrate as shown in FIG. 15 r. The P+ region1503, formed at the third location, is under the one or more ILD bumps1517 and do not form any direct contact with the first silicide layer1520.

A second silicide layer 1522 is then formed on bottom of the SiCsubstrate for forming a second Ohmic contact as shown in FIG. 15 s. Inan embodiment, the second silicide layer 1522 is then formed on back ofthe SiC substrate for forming the second Ohmic contact. In anembodiment, the second silicide layer 1522 is also the nickel-basedsilicide layer. A second pad metal 1526 is then formed on bottom of thesecond silicide layer 1522 of the SiC substrate as shown in FIG. 15 t.In an embodiment, the second pad metal formation is performed by atleast one of e-beam and sputtering.

A fourth patterned hard mask layer 1511 is then formed on the SiCsubstrate once the first Ohmic contact and the second Ohmic contact areformed on topside and bottom side/back side of the SiC substraterespectively. The fourth patterned hard mask layer 1511 is formed forselectively removing the exposed portions of the ILD layer 1518 anddepositing a metal region (e.g. a Schottky metal region 1528) shown inFIGS. 12 d, 12 e & 12 f on top of the SiC substrate. The fourthpatterned hard mask layer 1511 is used for both etching the portion ofthe ILD layer 1518 and lifting off the Schottky metal region 1528 whenSchottky metal is deposited. The Schottky metal region 1528 is in directcontact with the N− drift layer 1504 and bridge two adjacent P-wellregions 1506 (i.e. bridges the adjacent unit cells). The Schottky metalregion 1528 is then annealed with a predefined thermal budget forforming a Schottky metal contact between the Schottky metal region 1528and the portion of the N− drift layer 1504 exposed at the top surface ofthe SiC substrate. In an embodiment, the predefined thermal budgetranges from 55° C. to 1100° C. In FIGS. 12 d, 12 e & 12 f, the first padmetal and the second pad metal formation are performed once the Schottkymetal region 1528 formation is completed.

The present disclosure may be embodied in other specific forms withoutdeparting from its spirit or characteristics. The described embodimentsare to be considered in all respects only as illustrative and notrestrictive. The scope is, therefore, indicated by the appended claimsrather than by the foregoing description. All changes which come withinthe meaning and range of equivalency of the claims are to be embracedwithin their scope.

Other embodiments are also within the scope of the following claims.

Although, various embodiments which incorporate the teachings describedin detail herein, those skilled in the art can readily devise many othervaried embodiments that still incorporate these teachings. For example,a complementary SiC DMOSFET device with a P+ substrate, P− drift layerand P+ source can be created in a N-well region. The embodimentsdescribed are all applicable to the complementary DMOSFET as well.

All documents (patents, patent publications or other publications)mentioned in the specification are incorporated herein in their entiretyby reference.

INCORPORATION BY REFERENCE

All publications, patents, and patent applications cited in thisSpecification are hereby incorporated by reference in their entirety,including:

-   WO2011013042A1 entitled “Germanium n-MOSFET Devices and production    methods”;-   EP0899791B1 entitled “Trench-gated MOSFET with bidirectional voltage    clamping”;-   JP2008541459A entitled “Silicon carbide junction barrier Schottky    diode with suppressed minority carrier injection”;-   U.S. Pat. No. 9,875,332 entitled “Contact Resistance Mitigation”;-   U.S. Pat. No. 5,731,605A entitled “Turn-off power semiconductor    component with a particular ballast resistor structure”;-   U.S. Pat. No. 5,461,250 entitled “SiGe thin film or SOI MOSFET and    method for making the same”;-   U.S. Pat. No. 9,899,512B2 entitled “Silicon Carbide device and    method of making thereof”;-   U.S. Pat. No. 9,876,104B2 entitled “High voltage semiconductor    devices and methods of making the devices”;-   US20190013312A1 entitled “MOSFET device of silicon carbide having an    integrated diode and manufacturing process thereof”;-   U.S. Pat. No. 9,318,597B2 entitled “Layout configurations for    integrating Schottky contacts into a power transistor device”; and-   U.S. Pat. No. 8,436,367B1 entitled “SiC power vertical DMOS with    increased safe operating area”.

What is claimed is:
 1. A device comprising a unit cell on a SiliconCarbide (SiC) substrate, the unit cell comprising: a first conductivitytype source region; a second conductivity type well region; a secondconductivity type well contact region; and a silicide layer, wherein thedevice comprises a vertical Silicon Carbide double-implantation metaloxide semiconductor field-effect transistor (DMOSFET) comprising a drainterminal on a backside of the SiC substrate and a source terminal on atopside of the SiC substrate, wherein a lateral extent of the secondconductivity type well contact region varies with a non-zero value indirection orthogonal to the unit cell, and wherein the secondconductivity type well contact region is isolated from a source metalregion.
 2. The device of claim 1, wherein the second conductivity typewell contact region comprises a periodic contact with the source metalregion via the silicide layer between an adjacent interlayer dielectric(ILD) region.
 3. The device of claim 1, wherein the second conductivitytype well contact region comprises a periodic spacing between the firstconductivity type source region and the second conductivity type wellcontact region.
 4. The device of claim 3, wherein the secondconductivity type well contact region comprises a target size, a targetspacing between adjacent junction points located between the secondconductivity type well contact region, and the silicide layer between anadjacent ILD region.
 5. The device of claim 4, wherein the target sizeranges from 10 nm to 10 μm.
 6. The device of claim 4, wherein the targetspacing ranges from 10 nm to 10 μm.
 7. The device of claim 1, whereinthe second conductivity type well contact region meanders from aperspective of a cross-sectional view of the device.
 8. The device ofclaim 7, wherein the second conductivity type well contact regioncomprises a target size, a target spacing between adjacent junctionpoints located between the second conductivity type well contact region,and the silicide layer between an adjacent ILD region.
 9. The device ofclaim 8, wherein the target size ranges from 10 nm to 10 μm and thetarget spacing ranges from 10 nm to 10 μm.
 10. The device of claim 1,wherein the device comprises the first conductivity type source regionwithin the second conductivity type well region.
 11. The device of claim1, wherein the device comprises the second conductivity type wellcontact region within the second conductivity type well region.
 12. Thedevice of claim 1, wherein the vertical Silicon Carbide (SiC) DMOSFETcomprises one of (a) a planar gate DMOSFET and (b) a trench gateDMOSFET, the planar gate DMOSFET comprises one of (a) n-type planar gateDMOSFET and (b) a p-type planar gate DMOSFET, and the trench gateDMOSFET comprises one of (a) n-type trench gate DMOSFET and (b) a p-typetrench gate DMOSFET.
 13. The device of claim 7, wherein the secondconductivity type well contact region meanders from the perspective ofthe cross-sectional view of the device comprises: the secondconductivity type well contact region under an interlayer dielectric(ILD) region do not have direct contact with the source metal region.14. A device comprising: a silicon carbide (SiC) double-implantationmetal oxide semiconductor field effect transistor (DMOSFET) capable ofcarrying a drain current of less than negative 500 milliamperes at adrain voltage of negative 3 volts, wherein a lateral extent of a secondconductivity type well contact region varies with a non-zero value indirection orthogonal to a unit cell, and wherein a first lateral end ofthe second conductivity type well contact region is contiguous with afirst conductivity type source region and a second lateral end of thesecond conductivity type well contact region is non-contiguous with thefirst conductivity type source region.
 15. The device of claim 14,wherein the device comprises a Schottky diode region and a p-n dioderegion, the Schottky diode region connected in series with the p-n dioderegion.
 16. The device of claim 14, wherein the device furthercomprises: the first conductivity type source region; a secondconductivity type well region; the second conductivity type well contactregion; and a silicide layer, wherein the second conductivity type wellcontact region is isolated from a source metal region.
 17. A devicecomprising a unit cell on a Silicon Carbide (SiC) substrate, the unitcell comprising: a first conductivity type source region; a secondconductivity type well region; a second conductivity type well contactregion; and a silicide layer, wherein a lateral extent of the secondconductivity type well contact region varies with a non-zero value indirection orthogonal to the unit cell, and wherein the secondconductivity type well contact region is isolated from a source metalregion.
 18. The device of claim 17, wherein the device comprises a metaloxide semiconductor field effect transistor (MOSFET).
 19. The device ofclaim 18, wherein the metal oxide semiconductor field effect transistor(MOSFET) comprises a trench gate MOSFET.
 20. The device of claim 17,wherein the device comprises a vertical Silicon Carbide (SiC)double-implantation metal oxide semiconductor field effect transistor(DMOSFET), the vertical Silicon Carbide (SiC) DMOSFET comprises one of atrench gate DMOSFET and a planar gate DMOSFET.